JPS5211874B2 - - Google Patents

Info

Publication number
JPS5211874B2
JPS5211874B2 JP47013741A JP1374172A JPS5211874B2 JP S5211874 B2 JPS5211874 B2 JP S5211874B2 JP 47013741 A JP47013741 A JP 47013741A JP 1374172 A JP1374172 A JP 1374172A JP S5211874 B2 JPS5211874 B2 JP S5211874B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP47013741A
Other languages
Japanese (ja)
Other versions
JPS4883778A (cg-RX-API-DMAC10.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP47013741A priority Critical patent/JPS5211874B2/ja
Priority to GB3613572A priority patent/GB1331028A/en
Priority to CA148,789A priority patent/CA970079A/en
Priority to DE2238569A priority patent/DE2238569C3/de
Priority to FR7228210A priority patent/FR2148480B1/fr
Publication of JPS4883778A publication Critical patent/JPS4883778A/ja
Priority to US443670A priority patent/US3879837A/en
Publication of JPS5211874B2 publication Critical patent/JPS5211874B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H10W72/073—

Landscapes

  • Die Bonding (AREA)
JP47013741A 1971-08-07 1972-02-07 Expired JPS5211874B2 (cg-RX-API-DMAC10.html)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP47013741A JPS5211874B2 (cg-RX-API-DMAC10.html) 1972-02-07 1972-02-07
GB3613572A GB1331028A (en) 1971-08-07 1972-08-02 Method of soldering a semiconductor plate
CA148,789A CA970079A (en) 1971-08-07 1972-08-04 Method of soldering a semiconductor plate
DE2238569A DE2238569C3 (de) 1971-08-07 1972-08-04 Verfahren zum Löten einer Halbleiterplatte
FR7228210A FR2148480B1 (cg-RX-API-DMAC10.html) 1971-08-07 1972-08-04
US443670A US3879837A (en) 1971-08-07 1974-02-19 Method of soldering a semiconductor plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP47013741A JPS5211874B2 (cg-RX-API-DMAC10.html) 1972-02-07 1972-02-07

Publications (2)

Publication Number Publication Date
JPS4883778A JPS4883778A (cg-RX-API-DMAC10.html) 1973-11-08
JPS5211874B2 true JPS5211874B2 (cg-RX-API-DMAC10.html) 1977-04-02

Family

ID=11841675

Family Applications (1)

Application Number Title Priority Date Filing Date
JP47013741A Expired JPS5211874B2 (cg-RX-API-DMAC10.html) 1971-08-07 1972-02-07

Country Status (1)

Country Link
JP (1) JPS5211874B2 (cg-RX-API-DMAC10.html)

Also Published As

Publication number Publication date
JPS4883778A (cg-RX-API-DMAC10.html) 1973-11-08

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