JPS5211874B2 - - Google Patents

Info

Publication number
JPS5211874B2
JPS5211874B2 JP1374172A JP1374172A JPS5211874B2 JP S5211874 B2 JPS5211874 B2 JP S5211874B2 JP 1374172 A JP1374172 A JP 1374172A JP 1374172 A JP1374172 A JP 1374172A JP S5211874 B2 JPS5211874 B2 JP S5211874B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1374172A
Other versions
JPS4883778A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1374172A priority Critical patent/JPS5211874B2/ja
Priority to GB3613572A priority patent/GB1331028A/en
Priority to DE2238569A priority patent/DE2238569C3/de
Priority to FR7228210A priority patent/FR2148480B1/fr
Priority to CA148,789A priority patent/CA970079A/en
Publication of JPS4883778A publication Critical patent/JPS4883778A/ja
Priority to US443670A priority patent/US3879837A/en
Publication of JPS5211874B2 publication Critical patent/JPS5211874B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys

Landscapes

  • Die Bonding (AREA)
JP1374172A 1971-08-07 1972-02-07 Expired JPS5211874B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP1374172A JPS5211874B2 (ja) 1972-02-07 1972-02-07
GB3613572A GB1331028A (en) 1971-08-07 1972-08-02 Method of soldering a semiconductor plate
DE2238569A DE2238569C3 (de) 1971-08-07 1972-08-04 Verfahren zum Löten einer Halbleiterplatte
FR7228210A FR2148480B1 (ja) 1971-08-07 1972-08-04
CA148,789A CA970079A (en) 1971-08-07 1972-08-04 Method of soldering a semiconductor plate
US443670A US3879837A (en) 1971-08-07 1974-02-19 Method of soldering a semiconductor plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1374172A JPS5211874B2 (ja) 1972-02-07 1972-02-07

Publications (2)

Publication Number Publication Date
JPS4883778A JPS4883778A (ja) 1973-11-08
JPS5211874B2 true JPS5211874B2 (ja) 1977-04-02

Family

ID=11841675

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1374172A Expired JPS5211874B2 (ja) 1971-08-07 1972-02-07

Country Status (1)

Country Link
JP (1) JPS5211874B2 (ja)

Also Published As

Publication number Publication date
JPS4883778A (ja) 1973-11-08

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