JPS52102860A - Flow type soldering device - Google Patents

Flow type soldering device

Info

Publication number
JPS52102860A
JPS52102860A JP1766477A JP1766477A JPS52102860A JP S52102860 A JPS52102860 A JP S52102860A JP 1766477 A JP1766477 A JP 1766477A JP 1766477 A JP1766477 A JP 1766477A JP S52102860 A JPS52102860 A JP S52102860A
Authority
JP
Japan
Prior art keywords
flow type
soldering device
type soldering
flow
type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1766477A
Other languages
Japanese (ja)
Inventor
Fururii Kaaru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schleuniger & Co Dr K
Original Assignee
Schleuniger & Co Dr K
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schleuniger & Co Dr K filed Critical Schleuniger & Co Dr K
Publication of JPS52102860A publication Critical patent/JPS52102860A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP1766477A 1976-02-20 1977-02-18 Flow type soldering device Pending JPS52102860A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH207776A CH607622A5 (en) 1976-02-20 1976-02-20 Wave-soldering apparatus

Publications (1)

Publication Number Publication Date
JPS52102860A true JPS52102860A (en) 1977-08-29

Family

ID=4225358

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1766477A Pending JPS52102860A (en) 1976-02-20 1977-02-18 Flow type soldering device

Country Status (5)

Country Link
JP (1) JPS52102860A (en)
CH (1) CH607622A5 (en)
DE (1) DE2619342C3 (en)
FR (1) FR2341393A1 (en)
GB (1) GB1556546A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5961285A (en) * 1996-06-19 1999-10-05 Ak Steel Corporation Method and apparatus for removing bottom dross from molten zinc during galvannealing or galvanizing

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2856460C3 (en) * 1978-12-28 1982-02-11 Gebr. Schmid GmbH & Co, 7290 Freudenstadt Device for applying a layer of solder to a printed circuit board
CH660145A5 (en) * 1983-07-15 1987-03-31 Landis & Gyr Ag METHOD FOR PROTECTING THE SURFACE OF A SOLDER BATH.
GB8324231D0 (en) * 1983-09-09 1983-10-12 Dolphin Machinery Soldering apparatus
DE3339887A1 (en) * 1983-11-04 1985-05-15 Klaus 6107 Reinheim Obermann DEVICE FOR TINNING PCBS
EP0147000A1 (en) * 1983-12-15 1985-07-03 Hollis Automation Inc. Mass wave soldering system I
US4566624A (en) * 1983-12-16 1986-01-28 Hollis Automation, Inc. Mass wave soldering system
DE3441687C2 (en) * 1984-11-15 1986-10-02 Kirsten Kabeltechnik AG, Welschenrohr Wave soldering device
DE4041272C2 (en) * 1990-12-21 1996-12-05 Siemens Ag Wave soldering device
JP3187849B2 (en) * 1991-01-28 2001-07-16 ソニー株式会社 Jet solder bath
US5397049A (en) * 1991-12-06 1995-03-14 Electrovert Ltd. Gas shrouded solder wave with reduced solder splatter
DE102006032051B4 (en) * 2006-07-10 2022-11-24 Endress+Hauser SE+Co. KG Wave soldering system for soldering electronic components on a printed circuit board
DE102007053857A1 (en) 2007-11-09 2009-05-14 Endress + Hauser Gmbh + Co. Kg Method for operating a wave soldering system

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3726007A (en) * 1971-02-02 1973-04-10 Martin Marietta Corp Component side printed circuit soldering

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5961285A (en) * 1996-06-19 1999-10-05 Ak Steel Corporation Method and apparatus for removing bottom dross from molten zinc during galvannealing or galvanizing

Also Published As

Publication number Publication date
GB1556546A (en) 1979-11-28
DE2619342A1 (en) 1977-08-25
FR2341393B1 (en) 1982-05-28
FR2341393A1 (en) 1977-09-16
CH607622A5 (en) 1978-09-29
DE2619342C3 (en) 1979-05-03
DE2619342B2 (en) 1978-09-14

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