JPS5199473A - Riidofureemu - Google Patents

Riidofureemu

Info

Publication number
JPS5199473A
JPS5199473A JP2399575A JP2399575A JPS5199473A JP S5199473 A JPS5199473 A JP S5199473A JP 2399575 A JP2399575 A JP 2399575A JP 2399575 A JP2399575 A JP 2399575A JP S5199473 A JPS5199473 A JP S5199473A
Authority
JP
Japan
Prior art keywords
riidofureemu
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2399575A
Other languages
English (en)
Inventor
Hiroshi Yamamoto
Masatoshi Utaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2399575A priority Critical patent/JPS5199473A/ja
Publication of JPS5199473A publication Critical patent/JPS5199473A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP2399575A 1975-02-28 1975-02-28 Riidofureemu Pending JPS5199473A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2399575A JPS5199473A (ja) 1975-02-28 1975-02-28 Riidofureemu

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2399575A JPS5199473A (ja) 1975-02-28 1975-02-28 Riidofureemu

Publications (1)

Publication Number Publication Date
JPS5199473A true JPS5199473A (ja) 1976-09-02

Family

ID=12126149

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2399575A Pending JPS5199473A (ja) 1975-02-28 1975-02-28 Riidofureemu

Country Status (1)

Country Link
JP (1) JPS5199473A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62183132A (ja) * 1986-02-06 1987-08-11 Fuji Electric Co Ltd 半導体素子の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62183132A (ja) * 1986-02-06 1987-08-11 Fuji Electric Co Ltd 半導体素子の製造方法

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