JPS5199226A - - Google Patents
Info
- Publication number
- JPS5199226A JPS5199226A JP51006350A JP635076A JPS5199226A JP S5199226 A JPS5199226 A JP S5199226A JP 51006350 A JP51006350 A JP 51006350A JP 635076 A JP635076 A JP 635076A JP S5199226 A JPS5199226 A JP S5199226A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/117—Stacked arrangements of devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L23/4012—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws for stacked arrangements of a plurality of semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2502472A DE2502472C2 (de) | 1975-01-22 | 1975-01-22 | Kühlkörper für Thyristoren |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5199226A true JPS5199226A (US20100056889A1-20100304-C00004.png) | 1976-09-01 |
Family
ID=5937013
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP51006350A Pending JPS5199226A (US20100056889A1-20100304-C00004.png) | 1975-01-22 | 1976-01-22 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPS5199226A (US20100056889A1-20100304-C00004.png) |
DE (1) | DE2502472C2 (US20100056889A1-20100304-C00004.png) |
SE (1) | SE7600215L (US20100056889A1-20100304-C00004.png) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103493196A (zh) * | 2012-02-06 | 2014-01-01 | 华为技术有限公司 | 具有层叠鳍片的散热片和此散热片的生产方法 |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2543397B1 (fr) * | 1983-03-25 | 1985-06-28 | Thomson Csf | Procede de fabrication d'un dissipateur thermique et un dissipateur thermique obtenu par ce procede |
DE3518310A1 (de) * | 1985-05-22 | 1986-11-27 | Aluminium-Walzwerke Singen Gmbh, 7700 Singen | Kuehlkoerper fuer halbleiterbauelemente und verfahren zu seiner herstellung |
DE3703873A1 (de) * | 1987-02-07 | 1988-08-18 | Sueddeutsche Kuehler Behr | Kuehlkoerper, insbesondere zum kuehlen elektronischer bauelemente |
DE3822890A1 (de) * | 1988-03-15 | 1989-09-28 | Siemens Ag | Kuehlanordnung fuer einen optischen zeichengenerator |
AT399791B (de) * | 1992-08-06 | 1995-07-25 | Voith Elin Elektronik Ges M B | Stromrichter |
DE4314663A1 (de) * | 1993-05-04 | 1994-11-10 | Alusuisse Lonza Services Ag | Kühlkörper für Halbleiterbauelemente |
DE9412460U1 (de) * | 1994-08-02 | 1995-12-14 | Hoogovens Aluminium Profiltechnik Gmbh, 88267 Vogt | Kühlvorrichtung für elektrische bzw. elektronische Bauelemente mit einer Grundplatte und mit Kühlelementen |
US5791406A (en) * | 1994-08-02 | 1998-08-11 | Hoogovens Aluminium Profiltechnik, Gmbh | Cooling device for electrical or electronic components having a base plate and cooling elements and method for manufacturing the same |
DE29602367U1 (de) * | 1995-03-24 | 1996-05-15 | Alusuisse-Lonza Services AG, Neuhausen am Rheinfall | Kühlkörper für Halbleiterbauelemente o.dgl. |
US5819407A (en) * | 1995-04-19 | 1998-10-13 | Tousui, Ltd. | Method of joining together a pair of members each having a high thermal conductivity |
DE29507286U1 (de) * | 1995-05-04 | 1995-07-20 | Alusuisse Lonza Services Ag | Kühlkörper für Halbleiterbauelemente o.dgl. Geräte |
DE69616870T2 (de) * | 1995-05-16 | 2002-05-29 | Tousui, Ltd. | Verfahren zum Verbinden zweier Werkstücke, jedes mit hoher Wärmeleitfähigkeit |
GB2300974B (en) * | 1995-05-16 | 1999-12-29 | Redpoint Thermalloy Ltd | A heatsink and a method of forming the same |
GB9509866D0 (en) * | 1995-05-16 | 1995-07-12 | Thermalloy Inc | A heatsink and a method and an assembly for forming the same |
DE59611356D1 (de) * | 1996-01-31 | 2006-07-27 | Alcan Tech & Man Ag | Kühlkörper für Halbleiterbauelemente od. dgl. |
DE29602212U1 (de) * | 1996-02-09 | 1996-05-02 | Alusuisse-Lonza Services AG, Neuhausen am Rheinfall | Kühlkörper für Halbleiterbauelemente o.dgl. Einrichtungen |
EP0800890A1 (en) * | 1996-04-08 | 1997-10-15 | Tousui Ltd | Heat sink |
DE29618794U1 (de) * | 1996-10-29 | 1997-06-19 | Leber, Dieter, Dipl.-Ing., 91207 Lauf | Stranggepreßter Profilkühlkörper für Leistungshalbleiter |
US6059017A (en) * | 1998-04-20 | 2000-05-09 | The United States Of America As Represented By The Secretary Of The Navy | Directional heat exchanger |
TW376171U (en) * | 1998-11-24 | 1999-12-01 | Foxconn Prec Components Co Ltd | Radiating device |
US6520248B2 (en) * | 2000-05-18 | 2003-02-18 | Aavid Thermalloy Llc | Heat sink having bonded cooling fins |
DE10056387B4 (de) * | 2000-11-14 | 2008-11-13 | Corus Aluminium Profiltechnik Gmbh | Kühlvorrichtung und Verfahren zu deren Herstellung sowie Vorrichtung zur Durchführung des Verfahrens |
DE10157240B4 (de) * | 2001-11-22 | 2012-10-25 | Aleris Aluminum Vogt Gmbh | Kühlkörper und Verfahren zur Herstellung desselben |
DE10200019B4 (de) * | 2002-01-02 | 2006-07-06 | Alcan Technology & Management Ag | Kühlkörper für Halbleiterbauelemente, Verfahren zu dessen Herstellung und Werkzeug zur Durchführung des Verfahrens |
DE10229532B4 (de) * | 2002-07-01 | 2008-06-19 | Alcan Technology & Management Ag | Kühlvorrichtung für Halbleiterbauelemente |
DE102005007041A1 (de) | 2005-02-15 | 2006-08-17 | Alcan Technology & Management Ag | Kühlkörper für Halbleiterbauelemente oder dgl. Einrichtungen sowie Verfahren zu dessen Herstellung |
ES2329625T3 (es) | 2006-11-22 | 2009-11-27 | ALCAN TECHNOLOGY & MANAGEMENT AG | Cuerpo de refrigeracion para componentes de semiconductores o fuentes de calor similares asi como procedimiento para su fabricacion. |
EP2027948A1 (de) * | 2007-08-20 | 2009-02-25 | Alcan Technology & Management AG | Verfahren zum Herstellen eines Flachprofils, insbesondere eines Kühlkörpers für Halbleiterelemente od.dgl. Bauteile, sowie Profil dazu |
DE102008030110A1 (de) | 2008-04-22 | 2009-10-29 | Alcan Technology & Management Ag | Kühlkörper für Halbleiterbauelemente aus einer stranggepressten Aluminiumlegierung |
WO2015141305A1 (ja) * | 2014-03-18 | 2015-09-24 | 富士電機株式会社 | 電力変換装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1959094A1 (de) * | 1969-11-25 | 1971-05-27 | Licentia Gmbh | Verfahren zur Herstellung von Halbleiteranordnungen |
DE2132139C3 (de) * | 1971-06-29 | 1974-10-24 | Merkur Gmbh Metallwerk | Anwendung des Kaltpreßschweißverfahrens zum Verbinden zweier gegeneinander gepreßter Werkstückteile |
-
1975
- 1975-01-22 DE DE2502472A patent/DE2502472C2/de not_active Expired
-
1976
- 1976-01-12 SE SE7600215A patent/SE7600215L/xx unknown
- 1976-01-22 JP JP51006350A patent/JPS5199226A/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103493196A (zh) * | 2012-02-06 | 2014-01-01 | 华为技术有限公司 | 具有层叠鳍片的散热片和此散热片的生产方法 |
Also Published As
Publication number | Publication date |
---|---|
DE2502472A1 (de) | 1976-07-29 |
SE7600215L (sv) | 1976-07-23 |
DE2502472C2 (de) | 1982-09-02 |