JPS5197567U - - Google Patents
Info
- Publication number
- JPS5197567U JPS5197567U JP1571975U JP1571975U JPS5197567U JP S5197567 U JPS5197567 U JP S5197567U JP 1571975 U JP1571975 U JP 1571975U JP 1571975 U JP1571975 U JP 1571975U JP S5197567 U JPS5197567 U JP S5197567U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1571975U JPS5197567U (ko) | 1975-02-03 | 1975-02-03 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1571975U JPS5197567U (ko) | 1975-02-03 | 1975-02-03 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5197567U true JPS5197567U (ko) | 1976-08-05 |
Family
ID=28096770
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1571975U Pending JPS5197567U (ko) | 1975-02-03 | 1975-02-03 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5197567U (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5896738A (ja) * | 1981-12-03 | 1983-06-08 | Mitsubishi Electric Corp | 半導体装置の樹脂封止金型 |
JPS59218736A (ja) * | 1983-05-26 | 1984-12-10 | Toshiba Corp | 半導体樹脂封止装置 |
-
1975
- 1975-02-03 JP JP1571975U patent/JPS5197567U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5896738A (ja) * | 1981-12-03 | 1983-06-08 | Mitsubishi Electric Corp | 半導体装置の樹脂封止金型 |
JPS59218736A (ja) * | 1983-05-26 | 1984-12-10 | Toshiba Corp | 半導体樹脂封止装置 |