JPS5197567U - - Google Patents

Info

Publication number
JPS5197567U
JPS5197567U JP1571975U JP1571975U JPS5197567U JP S5197567 U JPS5197567 U JP S5197567U JP 1571975 U JP1571975 U JP 1571975U JP 1571975 U JP1571975 U JP 1571975U JP S5197567 U JPS5197567 U JP S5197567U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1571975U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1571975U priority Critical patent/JPS5197567U/ja
Publication of JPS5197567U publication Critical patent/JPS5197567U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
JP1571975U 1975-02-03 1975-02-03 Pending JPS5197567U (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1571975U JPS5197567U (ko) 1975-02-03 1975-02-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1571975U JPS5197567U (ko) 1975-02-03 1975-02-03

Publications (1)

Publication Number Publication Date
JPS5197567U true JPS5197567U (ko) 1976-08-05

Family

ID=28096770

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1571975U Pending JPS5197567U (ko) 1975-02-03 1975-02-03

Country Status (1)

Country Link
JP (1) JPS5197567U (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5896738A (ja) * 1981-12-03 1983-06-08 Mitsubishi Electric Corp 半導体装置の樹脂封止金型
JPS59218736A (ja) * 1983-05-26 1984-12-10 Toshiba Corp 半導体樹脂封止装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5896738A (ja) * 1981-12-03 1983-06-08 Mitsubishi Electric Corp 半導体装置の樹脂封止金型
JPS59218736A (ja) * 1983-05-26 1984-12-10 Toshiba Corp 半導体樹脂封止装置

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