JPS5197373A - - Google Patents
Info
- Publication number
- JPS5197373A JPS5197373A JP50023184A JP2318475A JPS5197373A JP S5197373 A JPS5197373 A JP S5197373A JP 50023184 A JP50023184 A JP 50023184A JP 2318475 A JP2318475 A JP 2318475A JP S5197373 A JPS5197373 A JP S5197373A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2318475A JPS5845181B2 (ja) | 1975-02-24 | 1975-02-24 | 半導体装置の外部リ−ドの接続方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2318475A JPS5845181B2 (ja) | 1975-02-24 | 1975-02-24 | 半導体装置の外部リ−ドの接続方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5197373A true JPS5197373A (ja) | 1976-08-26 |
| JPS5845181B2 JPS5845181B2 (ja) | 1983-10-07 |
Family
ID=12103553
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2318475A Expired JPS5845181B2 (ja) | 1975-02-24 | 1975-02-24 | 半導体装置の外部リ−ドの接続方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5845181B2 (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06204295A (ja) * | 1992-12-28 | 1994-07-22 | Nec Corp | フィルムキャリアテープ及びそのリードのボンディング方法 |
-
1975
- 1975-02-24 JP JP2318475A patent/JPS5845181B2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06204295A (ja) * | 1992-12-28 | 1994-07-22 | Nec Corp | フィルムキャリアテープ及びそのリードのボンディング方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5845181B2 (ja) | 1983-10-07 |