JPS5193867A - Handotaisochino seiho - Google Patents

Handotaisochino seiho

Info

Publication number
JPS5193867A
JPS5193867A JP50018871A JP1887175A JPS5193867A JP S5193867 A JPS5193867 A JP S5193867A JP 50018871 A JP50018871 A JP 50018871A JP 1887175 A JP1887175 A JP 1887175A JP S5193867 A JPS5193867 A JP S5193867A
Authority
JP
Japan
Prior art keywords
handotaisochino
seiho
handotaisochino seiho
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50018871A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP50018871A priority Critical patent/JPS5193867A/en
Publication of JPS5193867A publication Critical patent/JPS5193867A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/30—Structure, shape, material or disposition of the layer connectors prior to the connecting process of a plurality of layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/061—Disposition
    • H01L2224/0618—Disposition being disposed on at least two different sides of the body, e.g. dual array
    • H01L2224/06181—On opposite sides of the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
    • H01L2224/26122—Auxiliary members for layer connectors, e.g. spacers being formed on the semiconductor or solid-state body to be connected
    • H01L2224/26145—Flow barriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/27—Manufacturing methods
    • H01L2224/27011—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature
    • H01L2224/27013—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature for holding or confining the layer connector, e.g. solder flow barrier

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Die Bonding (AREA)
JP50018871A 1975-02-17 1975-02-17 Handotaisochino seiho Pending JPS5193867A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50018871A JPS5193867A (en) 1975-02-17 1975-02-17 Handotaisochino seiho

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50018871A JPS5193867A (en) 1975-02-17 1975-02-17 Handotaisochino seiho

Publications (1)

Publication Number Publication Date
JPS5193867A true JPS5193867A (en) 1976-08-17

Family

ID=11983592

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50018871A Pending JPS5193867A (en) 1975-02-17 1975-02-17 Handotaisochino seiho

Country Status (1)

Country Link
JP (1) JPS5193867A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5815242A (en) * 1981-07-21 1983-01-28 Nec Home Electronics Ltd Manufacture of semiconductor device
JPS5816538A (en) * 1981-07-23 1983-01-31 Nec Corp Semiconductor device
JPS5817636A (en) * 1981-07-23 1983-02-01 Nec Home Electronics Ltd Manufacture of semiconductor device
JPS5848420A (en) * 1981-09-16 1983-03-22 Nec Home Electronics Ltd Manufacture of semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5815242A (en) * 1981-07-21 1983-01-28 Nec Home Electronics Ltd Manufacture of semiconductor device
JPS5816538A (en) * 1981-07-23 1983-01-31 Nec Corp Semiconductor device
JPS5817636A (en) * 1981-07-23 1983-02-01 Nec Home Electronics Ltd Manufacture of semiconductor device
JPS5848420A (en) * 1981-09-16 1983-03-22 Nec Home Electronics Ltd Manufacture of semiconductor device

Similar Documents

Publication Publication Date Title
GB1517403A (en) Dimethoxyquinazolines
BG27526A4 (en) Herbicid antipoison
AU1175076A (en) Indolylalkylpiperidines
AU1271076A (en) Push-toy
AU1169176A (en) Pyrimidinylureas
GB1519719A (en) Noroxymorphones
AU1390276A (en) Anthraquinone-bis-amidines
AU1804476A (en) Phenylbenzofurans
AU1261376A (en) Diarylbutanolamines
AU1100476A (en) Electropaints
AU1616876A (en) Cloches
JPS5192760A (en) Teiguyosetsuniokeru fuirawaiyasokyuhoho
JPS5180254A (en) Keijosokuteikino enkogosahoseihoshiki
JPS51100162A (en) Hokyohoosuno seizohohotosonosochi
AU1105976A (en) 5-nitrothiazolylimidazolidine
GB1518055A (en) Omega-trialkoxyalkanoates and -alkanethioates
BG27522A3 (en) Fungicœde compositiow
JPS51109348A (en) Shijono ryutaifunshashorisochi
JPS51103887A (en) Aburaokyuchakusuru oirufuensu
GB1518719A (en) Benzenedisulphonamides
CH610841A5 (en) Skibob
AU1387076A (en) Triazolbenzophenones
JPS5191219A (en) Fuenirefurinruino anteikaho
JPS51109649A (en) Erebeetano norikago
JPS51109011A (en) Namakonkuriitono kotsuzaikaishusochi