JPS5162668A - Moorudogatahandotaisochino seizohoho - Google Patents

Moorudogatahandotaisochino seizohoho

Info

Publication number
JPS5162668A
JPS5162668A JP49137439A JP13743974A JPS5162668A JP S5162668 A JPS5162668 A JP S5162668A JP 49137439 A JP49137439 A JP 49137439A JP 13743974 A JP13743974 A JP 13743974A JP S5162668 A JPS5162668 A JP S5162668A
Authority
JP
Japan
Prior art keywords
moorudogatahandotaisochino
seizohoho
moorudogatahandotaisochino seizohoho
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP49137439A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5755220B2 (enExample
Inventor
Yasuo Matsumura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
New Nippon Electric Co Ltd
Original Assignee
New Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by New Nippon Electric Co Ltd filed Critical New Nippon Electric Co Ltd
Priority to JP49137439A priority Critical patent/JPS5162668A/ja
Publication of JPS5162668A publication Critical patent/JPS5162668A/ja
Publication of JPS5755220B2 publication Critical patent/JPS5755220B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP49137439A 1974-11-27 1974-11-27 Moorudogatahandotaisochino seizohoho Granted JPS5162668A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP49137439A JPS5162668A (en) 1974-11-27 1974-11-27 Moorudogatahandotaisochino seizohoho

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP49137439A JPS5162668A (en) 1974-11-27 1974-11-27 Moorudogatahandotaisochino seizohoho

Publications (2)

Publication Number Publication Date
JPS5162668A true JPS5162668A (en) 1976-05-31
JPS5755220B2 JPS5755220B2 (enExample) 1982-11-22

Family

ID=15198638

Family Applications (1)

Application Number Title Priority Date Filing Date
JP49137439A Granted JPS5162668A (en) 1974-11-27 1974-11-27 Moorudogatahandotaisochino seizohoho

Country Status (1)

Country Link
JP (1) JPS5162668A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5322365A (en) * 1976-08-13 1978-03-01 Hitachi Ltd Resin mold type semiconductor device and its production

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5322365A (en) * 1976-08-13 1978-03-01 Hitachi Ltd Resin mold type semiconductor device and its production

Also Published As

Publication number Publication date
JPS5755220B2 (enExample) 1982-11-22

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