JPS515570A - - Google Patents

Info

Publication number
JPS515570A
JPS515570A JP7711174A JP7711174A JPS515570A JP S515570 A JPS515570 A JP S515570A JP 7711174 A JP7711174 A JP 7711174A JP 7711174 A JP7711174 A JP 7711174A JP S515570 A JPS515570 A JP S515570A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7711174A
Other languages
Japanese (ja)
Inventor
Ichiro Ishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7711174A priority Critical patent/JPS515570A/ja
Publication of JPS515570A publication Critical patent/JPS515570A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP7711174A 1974-07-04 1974-07-04 Pending JPS515570A (OSRAM)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7711174A JPS515570A (OSRAM) 1974-07-04 1974-07-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7711174A JPS515570A (OSRAM) 1974-07-04 1974-07-04

Publications (1)

Publication Number Publication Date
JPS515570A true JPS515570A (OSRAM) 1976-01-17

Family

ID=13624665

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7711174A Pending JPS515570A (OSRAM) 1974-07-04 1974-07-04

Country Status (1)

Country Link
JP (1) JPS515570A (OSRAM)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5568658A (en) * 1978-11-17 1980-05-23 Matsushita Electric Ind Co Ltd Lead wireless integrated circuit package
US4917153A (en) * 1987-05-29 1990-04-17 Tsudakoma Corporation Standby weft yarn cutting preventing device for a multicolor fluid jet loom
US6432155B1 (en) 2000-08-11 2002-08-13 Cp Kelco U.S., Inc. Compositions containing phosphate and xanthan gum variants

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3483308A (en) * 1968-10-24 1969-12-09 Texas Instruments Inc Modular packages for semiconductor devices

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3483308A (en) * 1968-10-24 1969-12-09 Texas Instruments Inc Modular packages for semiconductor devices

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5568658A (en) * 1978-11-17 1980-05-23 Matsushita Electric Ind Co Ltd Lead wireless integrated circuit package
US4917153A (en) * 1987-05-29 1990-04-17 Tsudakoma Corporation Standby weft yarn cutting preventing device for a multicolor fluid jet loom
US6432155B1 (en) 2000-08-11 2002-08-13 Cp Kelco U.S., Inc. Compositions containing phosphate and xanthan gum variants

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