JPS515570A - Handotaishusekikairono shijikiban - Google Patents
Handotaishusekikairono shijikibanInfo
- Publication number
- JPS515570A JPS515570A JP7711174A JP7711174A JPS515570A JP S515570 A JPS515570 A JP S515570A JP 7711174 A JP7711174 A JP 7711174A JP 7711174 A JP7711174 A JP 7711174A JP S515570 A JPS515570 A JP S515570A
- Authority
- JP
- Japan
- Prior art keywords
- shijikiban
- handotaishusekikairono
- handotaishusekikairono shijikiban
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7711174A JPS515570A (ja) | 1974-07-04 | 1974-07-04 | Handotaishusekikairono shijikiban |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7711174A JPS515570A (ja) | 1974-07-04 | 1974-07-04 | Handotaishusekikairono shijikiban |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS515570A true JPS515570A (ja) | 1976-01-17 |
Family
ID=13624665
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7711174A Pending JPS515570A (ja) | 1974-07-04 | 1974-07-04 | Handotaishusekikairono shijikiban |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS515570A (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5568658A (en) * | 1978-11-17 | 1980-05-23 | Matsushita Electric Ind Co Ltd | Lead wireless integrated circuit package |
US4917153A (en) * | 1987-05-29 | 1990-04-17 | Tsudakoma Corporation | Standby weft yarn cutting preventing device for a multicolor fluid jet loom |
US6432155B1 (en) | 2000-08-11 | 2002-08-13 | Cp Kelco U.S., Inc. | Compositions containing phosphate and xanthan gum variants |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3483308A (en) * | 1968-10-24 | 1969-12-09 | Texas Instruments Inc | Modular packages for semiconductor devices |
-
1974
- 1974-07-04 JP JP7711174A patent/JPS515570A/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3483308A (en) * | 1968-10-24 | 1969-12-09 | Texas Instruments Inc | Modular packages for semiconductor devices |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5568658A (en) * | 1978-11-17 | 1980-05-23 | Matsushita Electric Ind Co Ltd | Lead wireless integrated circuit package |
US4917153A (en) * | 1987-05-29 | 1990-04-17 | Tsudakoma Corporation | Standby weft yarn cutting preventing device for a multicolor fluid jet loom |
US6432155B1 (en) | 2000-08-11 | 2002-08-13 | Cp Kelco U.S., Inc. | Compositions containing phosphate and xanthan gum variants |
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