JPS515506B1 - - Google Patents

Info

Publication number
JPS515506B1
JPS515506B1 JP45033061A JP3306170A JPS515506B1 JP S515506 B1 JPS515506 B1 JP S515506B1 JP 45033061 A JP45033061 A JP 45033061A JP 3306170 A JP3306170 A JP 3306170A JP S515506 B1 JPS515506 B1 JP S515506B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP45033061A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS515506B1 publication Critical patent/JPS515506B1/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
JP45033061A 1969-05-15 1970-04-20 Pending JPS515506B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US82481869A 1969-05-15 1969-05-15

Publications (1)

Publication Number Publication Date
JPS515506B1 true JPS515506B1 (ja) 1976-02-20

Family

ID=25242393

Family Applications (1)

Application Number Title Priority Date Filing Date
JP45033061A Pending JPS515506B1 (ja) 1969-05-15 1970-04-20

Country Status (6)

Country Link
US (1) US3684960A (ja)
JP (1) JPS515506B1 (ja)
CA (1) CA921119A (ja)
DE (1) DE2017151A1 (ja)
FR (1) FR2046216A5 (ja)
GB (1) GB1246608A (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3847479A (en) * 1972-12-05 1974-11-12 Xerox Corp Cover for wire wrapped card chassis
CA1163721A (en) * 1980-08-18 1984-03-13 Milan Slamka Apparatus for the dynamic in-circuit testing of electronic digital circuit elements
FR2521305A1 (fr) * 1982-02-10 1983-08-12 Crouzet Sa Dispositif de controle de l'isolement des circuits imprimes
US4812745A (en) * 1987-05-29 1989-03-14 Teradyne, Inc. Probe for testing electronic components
US4858479A (en) * 1987-12-21 1989-08-22 Struers A/S Methods and means for use in examining the quality of plated-through holes in circuit boards
US4895033A (en) * 1987-12-21 1990-01-23 Voss Jorgen T Sample holder for use in the grinding or polishing of samples
US20030048108A1 (en) * 1993-04-30 2003-03-13 Beaman Brian Samuel Structural design and processes to control probe position accuracy in a wafer test probe assembly
JP2001056346A (ja) * 1999-08-19 2001-02-27 Fujitsu Ltd プローブカード及び複数の半導体装置が形成されたウエハの試験方法

Also Published As

Publication number Publication date
GB1246608A (en) 1971-09-15
US3684960A (en) 1972-08-15
CA921119A (en) 1973-02-13
FR2046216A5 (ja) 1971-03-05
DE2017151A1 (de) 1970-11-26

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