|
US3967251A
(en)
*
|
1975-04-17 |
1976-06-29 |
Xerox Corporation |
User variable computer memory module
|
|
JPS51123088A
(en)
*
|
1975-04-18 |
1976-10-27 |
Sanyo Electric Co Ltd |
Semiconducter ic device and its mask making method
|
|
US4003036A
(en)
*
|
1975-10-23 |
1977-01-11 |
American Micro-Systems, Inc. |
Single IGFET memory cell with buried storage element
|
|
US4502208A
(en)
*
|
1979-01-02 |
1985-03-05 |
Texas Instruments Incorporated |
Method of making high density VMOS electrically-programmable ROM
|
|
DE3175263D1
(en)
*
|
1981-06-25 |
1986-10-09 |
Ibm |
Electrically programmable read-only memory
|
|
US4543594A
(en)
*
|
1982-09-07 |
1985-09-24 |
Intel Corporation |
Fusible link employing capacitor structure
|
|
FR2535887A1
(fr)
*
|
1982-11-04 |
1984-05-11 |
Thomson Csf |
Procede de fabrication d'une structure logique integree programmee selon une configuration preetablie fixe
|
|
US5266829A
(en)
*
|
1986-05-09 |
1993-11-30 |
Actel Corporation |
Electrically-programmable low-impedance anti-fuse element
|
|
US4943538A
(en)
*
|
1986-05-09 |
1990-07-24 |
Actel Corporation |
Programmable low impedance anti-fuse element
|
|
US4823181A
(en)
*
|
1986-05-09 |
1989-04-18 |
Actel Corporation |
Programmable low impedance anti-fuse element
|
|
US5367208A
(en)
*
|
1986-09-19 |
1994-11-22 |
Actel Corporation |
Reconfigurable programmable interconnect architecture
|
|
GB2222024B
(en)
*
|
1988-08-18 |
1992-02-19 |
Stc Plc |
Improvements in integrated circuits
|
|
US5701027A
(en)
*
|
1991-04-26 |
1997-12-23 |
Quicklogic Corporation |
Programmable interconnect structures and programmable integrated circuits
|
|
US5498895A
(en)
*
|
1993-07-07 |
1996-03-12 |
Actel Corporation |
Process ESD protection devices for use with antifuses
|
|
US5369054A
(en)
*
|
1993-07-07 |
1994-11-29 |
Actel Corporation |
Circuits for ESD protection of metal-to-metal antifuses during processing
|
|
US5485031A
(en)
*
|
1993-11-22 |
1996-01-16 |
Actel Corporation |
Antifuse structure suitable for VLSI application
|
|
US5633189A
(en)
*
|
1994-08-01 |
1997-05-27 |
Actel Corporation |
Method of making metal to metal antifuse
|
|
US7153756B1
(en)
*
|
1998-08-04 |
2006-12-26 |
Texas Instruments Incorporated |
Bonded SOI with buried interconnect to handle or device wafer
|
|
US6351406B1
(en)
|
1998-11-16 |
2002-02-26 |
Matrix Semiconductor, Inc. |
Vertically stacked field programmable nonvolatile memory and method of fabrication
|
|
US6385074B1
(en)
|
1998-11-16 |
2002-05-07 |
Matrix Semiconductor, Inc. |
Integrated circuit structure including three-dimensional memory array
|
|
US6034882A
(en)
*
|
1998-11-16 |
2000-03-07 |
Matrix Semiconductor, Inc. |
Vertically stacked field programmable nonvolatile memory and method of fabrication
|
|
US7157314B2
(en)
|
1998-11-16 |
2007-01-02 |
Sandisk Corporation |
Vertically stacked field programmable nonvolatile memory and method of fabrication
|
|
US6888750B2
(en)
|
2000-04-28 |
2005-05-03 |
Matrix Semiconductor, Inc. |
Nonvolatile memory on SOI and compound semiconductor substrates and method of fabrication
|
|
US8575719B2
(en)
|
2000-04-28 |
2013-11-05 |
Sandisk 3D Llc |
Silicon nitride antifuse for use in diode-antifuse memory arrays
|
|
US6631085B2
(en)
|
2000-04-28 |
2003-10-07 |
Matrix Semiconductor, Inc. |
Three-dimensional memory array incorporating serial chain diode stack
|
|
US6624011B1
(en)
|
2000-08-14 |
2003-09-23 |
Matrix Semiconductor, Inc. |
Thermal processing for three dimensional circuits
|
|
US6580124B1
(en)
|
2000-08-14 |
2003-06-17 |
Matrix Semiconductor Inc. |
Multigate semiconductor device with vertical channel current and method of fabrication
|
|
EP2323164B1
(en)
|
2000-08-14 |
2015-11-25 |
SanDisk 3D LLC |
Multilevel memory array and method for making same
|
|
US6627530B2
(en)
|
2000-12-22 |
2003-09-30 |
Matrix Semiconductor, Inc. |
Patterning three dimensional structures
|
|
US6661730B1
(en)
|
2000-12-22 |
2003-12-09 |
Matrix Semiconductor, Inc. |
Partial selection of passive element memory cell sub-arrays for write operation
|
|
US6545898B1
(en)
|
2001-03-21 |
2003-04-08 |
Silicon Valley Bank |
Method and apparatus for writing memory arrays using external source of high programming voltage
|
|
US6897514B2
(en)
*
|
2001-03-28 |
2005-05-24 |
Matrix Semiconductor, Inc. |
Two mask floating gate EEPROM and method of making
|
|
US6593624B2
(en)
|
2001-09-25 |
2003-07-15 |
Matrix Semiconductor, Inc. |
Thin film transistors with vertically offset drain regions
|
|
US6525953B1
(en)
|
2001-08-13 |
2003-02-25 |
Matrix Semiconductor, Inc. |
Vertically-stacked, field-programmable, nonvolatile memory and method of fabrication
|
|
US6841813B2
(en)
*
|
2001-08-13 |
2005-01-11 |
Matrix Semiconductor, Inc. |
TFT mask ROM and method for making same
|
|
US6624485B2
(en)
|
2001-11-05 |
2003-09-23 |
Matrix Semiconductor, Inc. |
Three-dimensional, mask-programmed read only memory
|
|
US6853049B2
(en)
|
2002-03-13 |
2005-02-08 |
Matrix Semiconductor, Inc. |
Silicide-silicon oxide-semiconductor antifuse device and method of making
|
|
US6737675B2
(en)
|
2002-06-27 |
2004-05-18 |
Matrix Semiconductor, Inc. |
High density 3D rail stack arrays
|
|
US20060249753A1
(en)
*
|
2005-05-09 |
2006-11-09 |
Matrix Semiconductor, Inc. |
High-density nonvolatile memory array fabricated at low temperature comprising semiconductor diodes
|
|
US7177183B2
(en)
|
2003-09-30 |
2007-02-13 |
Sandisk 3D Llc |
Multiple twin cell non-volatile memory array and logic block structure and method therefor
|
|
US20090272958A1
(en)
*
|
2008-05-02 |
2009-11-05 |
Klaus-Dieter Ufert |
Resistive Memory
|
|
US8049299B2
(en)
*
|
2009-02-25 |
2011-11-01 |
Freescale Semiconductor, Inc. |
Antifuses with curved breakdown regions
|
|
US20100283053A1
(en)
*
|
2009-05-11 |
2010-11-11 |
Sandisk 3D Llc |
Nonvolatile memory array comprising silicon-based diodes fabricated at low temperature
|
|
US9627395B2
(en)
|
2015-02-11 |
2017-04-18 |
Sandisk Technologies Llc |
Enhanced channel mobility three-dimensional memory structure and method of making thereof
|
|
US9478495B1
(en)
|
2015-10-26 |
2016-10-25 |
Sandisk Technologies Llc |
Three dimensional memory device containing aluminum source contact via structure and method of making thereof
|