JPS5146159B2 - - Google Patents
Info
- Publication number
- JPS5146159B2 JPS5146159B2 JP1894072A JP1894072A JPS5146159B2 JP S5146159 B2 JPS5146159 B2 JP S5146159B2 JP 1894072 A JP1894072 A JP 1894072A JP 1894072 A JP1894072 A JP 1894072A JP S5146159 B2 JPS5146159 B2 JP S5146159B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1894072A JPS5146159B2 (cs) | 1972-02-25 | 1972-02-25 | |
| GB903473A GB1418169A (en) | 1972-02-25 | 1973-02-23 | Resist image formation process and resin compositions and materials for use in said process |
| DE19732309062 DE2309062C3 (de) | 1972-02-25 | 1973-02-23 | Verfahren zur Herstellung von Reliefbildern und dafür brauchbare Gemische und Aufzeichnungsmaterialien |
| US05/594,870 US4035189A (en) | 1972-02-25 | 1975-07-10 | Image forming curable resin compositions |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1894072A JPS5146159B2 (cs) | 1972-02-25 | 1972-02-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4888197A JPS4888197A (cs) | 1973-11-19 |
| JPS5146159B2 true JPS5146159B2 (cs) | 1976-12-07 |
Family
ID=11985626
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1894072A Expired JPS5146159B2 (cs) | 1972-02-25 | 1972-02-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5146159B2 (cs) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55127097A (en) * | 1979-03-20 | 1980-10-01 | Matsushita Electric Ind Co Ltd | Photocurable resin composition and solder resist |
| JP2848625B2 (ja) * | 1989-03-31 | 1999-01-20 | 株式会社東芝 | パターン形成方法 |
| JP4797224B2 (ja) * | 2000-04-25 | 2011-10-19 | 日立化成工業株式会社 | 接着剤組成物、回路接続用接着剤組成物、接続体及び半導体装置 |
| JP5011599B2 (ja) * | 2000-05-23 | 2012-08-29 | 日立化成工業株式会社 | 接着剤組成物、回路接続用接着剤組成物、回路接続材料、接続体及び半導体装置 |
| JP5958194B2 (ja) * | 2012-08-31 | 2016-07-27 | 住友化学株式会社 | 高分子化合物、及び該高分子化合物を含む絶縁層材料 |
| JP2014162778A (ja) * | 2013-02-27 | 2014-09-08 | Eiweiss Kk | 化合物、その製造方法および光塩基発生剤組成物 |
-
1972
- 1972-02-25 JP JP1894072A patent/JPS5146159B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4888197A (cs) | 1973-11-19 |