JPS5146159B2 - - Google Patents

Info

Publication number
JPS5146159B2
JPS5146159B2 JP1894072A JP1894072A JPS5146159B2 JP S5146159 B2 JPS5146159 B2 JP S5146159B2 JP 1894072 A JP1894072 A JP 1894072A JP 1894072 A JP1894072 A JP 1894072A JP S5146159 B2 JPS5146159 B2 JP S5146159B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1894072A
Other languages
Japanese (ja)
Other versions
JPS4888197A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1894072A priority Critical patent/JPS5146159B2/ja
Priority to DE19732309062 priority patent/DE2309062C3/de
Priority to GB903473A priority patent/GB1418169A/en
Publication of JPS4888197A publication Critical patent/JPS4888197A/ja
Priority to US05/594,870 priority patent/US4035189A/en
Publication of JPS5146159B2 publication Critical patent/JPS5146159B2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP1894072A 1972-02-25 1972-02-25 Expired JPS5146159B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP1894072A JPS5146159B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1972-02-25 1972-02-25
DE19732309062 DE2309062C3 (de) 1972-02-25 1973-02-23 Verfahren zur Herstellung von Reliefbildern und dafür brauchbare Gemische und Aufzeichnungsmaterialien
GB903473A GB1418169A (en) 1972-02-25 1973-02-23 Resist image formation process and resin compositions and materials for use in said process
US05/594,870 US4035189A (en) 1972-02-25 1975-07-10 Image forming curable resin compositions

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1894072A JPS5146159B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1972-02-25 1972-02-25

Publications (2)

Publication Number Publication Date
JPS4888197A JPS4888197A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1973-11-19
JPS5146159B2 true JPS5146159B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1976-12-07

Family

ID=11985626

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1894072A Expired JPS5146159B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1972-02-25 1972-02-25

Country Status (1)

Country Link
JP (1) JPS5146159B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55127097A (en) * 1979-03-20 1980-10-01 Matsushita Electric Ind Co Ltd Photocurable resin composition and solder resist
JP2848625B2 (ja) * 1989-03-31 1999-01-20 株式会社東芝 パターン形成方法
JP4797224B2 (ja) * 2000-04-25 2011-10-19 日立化成工業株式会社 接着剤組成物、回路接続用接着剤組成物、接続体及び半導体装置
JP5011599B2 (ja) * 2000-05-23 2012-08-29 日立化成工業株式会社 接着剤組成物、回路接続用接着剤組成物、回路接続材料、接続体及び半導体装置
JP5958194B2 (ja) * 2012-08-31 2016-07-27 住友化学株式会社 高分子化合物、及び該高分子化合物を含む絶縁層材料
JP2014162778A (ja) * 2013-02-27 2014-09-08 Eiweiss Kk 化合物、その製造方法および光塩基発生剤組成物

Also Published As

Publication number Publication date
JPS4888197A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1973-11-19

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