JPS5145951B2 - - Google Patents
Info
- Publication number
- JPS5145951B2 JPS5145951B2 JP47055993A JP5599372A JPS5145951B2 JP S5145951 B2 JPS5145951 B2 JP S5145951B2 JP 47055993 A JP47055993 A JP 47055993A JP 5599372 A JP5599372 A JP 5599372A JP S5145951 B2 JPS5145951 B2 JP S5145951B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/20—Resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3215—Doping the layers
- H01L21/32155—Doping polycristalline - or amorphous silicon layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/118—Oxide films
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/122—Polycrystalline
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP47055993A JPS5145951B2 (ja) | 1972-06-07 | 1972-06-07 | |
GB2484773A GB1384206A (en) | 1972-06-07 | 1973-05-24 | Method of forming a resistance layer in a semiconductor integrated circuit device |
US05/365,371 US3988181A (en) | 1972-06-07 | 1973-05-30 | Method of doping a polycrystalline silicon layer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP47055993A JPS5145951B2 (ja) | 1972-06-07 | 1972-06-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS4917984A JPS4917984A (ja) | 1974-02-16 |
JPS5145951B2 true JPS5145951B2 (ja) | 1976-12-06 |
Family
ID=13014592
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP47055993A Expired JPS5145951B2 (ja) | 1972-06-07 | 1972-06-07 |
Country Status (3)
Country | Link |
---|---|
US (1) | US3988181A (ja) |
JP (1) | JPS5145951B2 (ja) |
GB (1) | GB1384206A (ja) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53132275A (en) * | 1977-04-25 | 1978-11-17 | Nippon Telegr & Teleph Corp <Ntt> | Semiconductor device and its production |
JPS61206231A (ja) * | 1985-03-08 | 1986-09-12 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
US4764026A (en) * | 1986-07-07 | 1988-08-16 | Varian Associates, Inc. | Semiconductor wafer temperature measuring device and method |
WO1990011618A1 (en) * | 1989-03-23 | 1990-10-04 | Oki Electric Industry Co., Ltd. | Method of producing semiconductor devices |
AU5977190A (en) * | 1989-07-27 | 1991-01-31 | Nishizawa, Junichi | Impurity doping method with adsorbed diffusion source |
EP0417456A3 (en) * | 1989-08-11 | 1991-07-03 | Seiko Instruments Inc. | Method of producing semiconductor device |
EP0430274A3 (en) * | 1989-12-01 | 1993-03-24 | Seiko Instruments Inc. | Method of producing bipolar transistor |
CA2031254A1 (en) * | 1989-12-01 | 1991-06-02 | Kenji Aoki | Doping method of barrier region in semiconductor device |
JP2906260B2 (ja) * | 1989-12-01 | 1999-06-14 | セイコーインスツルメンツ株式会社 | Pn接合素子の製造方法 |
EP0430166A3 (en) * | 1989-12-01 | 1993-05-12 | Seiko Instruments Inc. | Method of doping impurity into semiconductor films and patterned semiconductor strip |
JP2920546B2 (ja) * | 1989-12-06 | 1999-07-19 | セイコーインスツルメンツ株式会社 | 同極ゲートmisトランジスタの製造方法 |
EP0505877A2 (en) * | 1991-03-27 | 1992-09-30 | Seiko Instruments Inc. | Impurity doping method with adsorbed diffusion source |
JP3001362B2 (ja) * | 1993-12-17 | 2000-01-24 | 日本電気株式会社 | 半導体装置の製造方法 |
US7425736B2 (en) * | 2005-06-07 | 2008-09-16 | United Microelectronics Corp. | Silicon layer with high resistance and fabricating method thereof |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3460007A (en) * | 1967-07-03 | 1969-08-05 | Rca Corp | Semiconductor junction device |
US3646665A (en) * | 1970-05-22 | 1972-03-07 | Gen Electric | Complementary mis-fet devices and method of fabrication |
US3673679A (en) * | 1970-12-01 | 1972-07-04 | Texas Instruments Inc | Complementary insulated gate field effect devices |
US3690968A (en) * | 1971-03-05 | 1972-09-12 | Advanced Memory Syst | Method for forming a field effect device |
-
1972
- 1972-06-07 JP JP47055993A patent/JPS5145951B2/ja not_active Expired
-
1973
- 1973-05-24 GB GB2484773A patent/GB1384206A/en not_active Expired
- 1973-05-30 US US05/365,371 patent/US3988181A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
USB365371I5 (ja) | 1975-01-28 |
GB1384206A (en) | 1975-02-19 |
US3988181A (en) | 1976-10-26 |
JPS4917984A (ja) | 1974-02-16 |