JPS5143579U - - Google Patents
Info
- Publication number
- JPS5143579U JPS5143579U JP11522574U JP11522574U JPS5143579U JP S5143579 U JPS5143579 U JP S5143579U JP 11522574 U JP11522574 U JP 11522574U JP 11522574 U JP11522574 U JP 11522574U JP S5143579 U JPS5143579 U JP S5143579U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11522574U JPS5143579U (ja) | 1974-09-26 | 1974-09-26 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11522574U JPS5143579U (ja) | 1974-09-26 | 1974-09-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5143579U true JPS5143579U (ja) | 1976-03-31 |
Family
ID=28347052
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11522574U Pending JPS5143579U (ja) | 1974-09-26 | 1974-09-26 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5143579U (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55105536U (ja) * | 1979-01-17 | 1980-07-23 | ||
JPS59179818U (ja) * | 1983-05-18 | 1984-12-01 | 日立金属株式会社 | 長尺丸棒材の整列並べ装置 |
JPS60193364A (ja) * | 1984-03-15 | 1985-10-01 | Matsushita Electronics Corp | 半導体装置およびその製造方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4416273Y1 (ja) * | 1966-02-28 | 1969-07-14 |
-
1974
- 1974-09-26 JP JP11522574U patent/JPS5143579U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4416273Y1 (ja) * | 1966-02-28 | 1969-07-14 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55105536U (ja) * | 1979-01-17 | 1980-07-23 | ||
JPS59179818U (ja) * | 1983-05-18 | 1984-12-01 | 日立金属株式会社 | 長尺丸棒材の整列並べ装置 |
JPS60193364A (ja) * | 1984-03-15 | 1985-10-01 | Matsushita Electronics Corp | 半導体装置およびその製造方法 |