JPS5142472B1 - - Google Patents

Info

Publication number
JPS5142472B1
JPS5142472B1 JP43041769A JP4176968A JPS5142472B1 JP S5142472 B1 JPS5142472 B1 JP S5142472B1 JP 43041769 A JP43041769 A JP 43041769A JP 4176968 A JP4176968 A JP 4176968A JP S5142472 B1 JPS5142472 B1 JP S5142472B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP43041769A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP43041769A priority Critical patent/JPS5142472B1/ja
Priority to US04/833,095 priority patent/US3988214A/en
Priority to NL6909115.A priority patent/NL161617C/xx
Priority to FR6919976A priority patent/FR2011079A1/fr
Priority to GB30717/69A priority patent/GB1276745A/en
Priority to DE1967363A priority patent/DE1967363C2/de
Priority to DE1930669A priority patent/DE1930669C2/de
Priority to US05/515,228 priority patent/US4001871A/en
Priority to MY214/75A priority patent/MY7500214A/xx
Priority to HK28676A priority patent/HK28676A/xx
Publication of JPS5142472B1 publication Critical patent/JPS5142472B1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP43041769A 1968-06-17 1968-06-17 Pending JPS5142472B1 (de)

Priority Applications (10)

Application Number Priority Date Filing Date Title
JP43041769A JPS5142472B1 (de) 1968-06-17 1968-06-17
US04/833,095 US3988214A (en) 1968-06-17 1969-06-13 Method of fabricating a semiconductor device
NL6909115.A NL161617C (nl) 1968-06-17 1969-06-13 Halfgeleiderinrichting met vlak oppervlak en werkwijze voor het vervaardigen daarvan.
FR6919976A FR2011079A1 (de) 1968-06-17 1969-06-16
GB30717/69A GB1276745A (en) 1968-06-17 1969-06-17 Improvements in or relating to semiconductor devices
DE1967363A DE1967363C2 (de) 1968-06-17 1969-06-18
DE1930669A DE1930669C2 (de) 1968-06-17 1969-06-18 Verfahren zur Herstellung einer integrierten Halbleiterschaltung
US05/515,228 US4001871A (en) 1968-06-17 1974-10-16 Semiconductor device
MY214/75A MY7500214A (en) 1968-06-17 1975-12-30 Improvements in or relating to semiconductor devices
HK28676A HK28676A (en) 1968-06-17 1976-05-20 Improvements in or relating to semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP43041769A JPS5142472B1 (de) 1968-06-17 1968-06-17

Publications (1)

Publication Number Publication Date
JPS5142472B1 true JPS5142472B1 (de) 1976-11-16

Family

ID=12617589

Family Applications (1)

Application Number Title Priority Date Filing Date
JP43041769A Pending JPS5142472B1 (de) 1968-06-17 1968-06-17

Country Status (1)

Country Link
JP (1) JPS5142472B1 (de)

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