JPS5140867A - - Google Patents
Info
- Publication number
- JPS5140867A JPS5140867A JP49113877A JP11387774A JPS5140867A JP S5140867 A JPS5140867 A JP S5140867A JP 49113877 A JP49113877 A JP 49113877A JP 11387774 A JP11387774 A JP 11387774A JP S5140867 A JPS5140867 A JP S5140867A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
- Control Of Position Or Direction (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11387774A JPS5310426B2 (enExample) | 1974-10-04 | 1974-10-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11387774A JPS5310426B2 (enExample) | 1974-10-04 | 1974-10-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5140867A true JPS5140867A (enExample) | 1976-04-06 |
| JPS5310426B2 JPS5310426B2 (enExample) | 1978-04-13 |
Family
ID=14623344
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11387774A Expired JPS5310426B2 (enExample) | 1974-10-04 | 1974-10-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5310426B2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56110244A (en) * | 1980-02-06 | 1981-09-01 | Hitachi Ltd | Printed circuit board for semiconductor device and wire bonding method thereof |
-
1974
- 1974-10-04 JP JP11387774A patent/JPS5310426B2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56110244A (en) * | 1980-02-06 | 1981-09-01 | Hitachi Ltd | Printed circuit board for semiconductor device and wire bonding method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5310426B2 (enExample) | 1978-04-13 |