JPS5139467U - - Google Patents

Info

Publication number
JPS5139467U
JPS5139467U JP11176374U JP11176374U JPS5139467U JP S5139467 U JPS5139467 U JP S5139467U JP 11176374 U JP11176374 U JP 11176374U JP 11176374 U JP11176374 U JP 11176374U JP S5139467 U JPS5139467 U JP S5139467U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11176374U
Other languages
Japanese (ja)
Other versions
JPS5410846Y2 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1974111763U priority Critical patent/JPS5410846Y2/ja
Publication of JPS5139467U publication Critical patent/JPS5139467U/ja
Application granted granted Critical
Publication of JPS5410846Y2 publication Critical patent/JPS5410846Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
JP1974111763U 1974-09-18 1974-09-18 Expired JPS5410846Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1974111763U JPS5410846Y2 (enrdf_load_stackoverflow) 1974-09-18 1974-09-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1974111763U JPS5410846Y2 (enrdf_load_stackoverflow) 1974-09-18 1974-09-18

Publications (2)

Publication Number Publication Date
JPS5139467U true JPS5139467U (enrdf_load_stackoverflow) 1976-03-24
JPS5410846Y2 JPS5410846Y2 (enrdf_load_stackoverflow) 1979-05-17

Family

ID=28337376

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1974111763U Expired JPS5410846Y2 (enrdf_load_stackoverflow) 1974-09-18 1974-09-18

Country Status (1)

Country Link
JP (1) JPS5410846Y2 (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53102382U (enrdf_load_stackoverflow) * 1977-01-21 1978-08-18
JPS6136709A (ja) * 1984-07-30 1986-02-21 Nec Corp 光フアイバ−結合装置
JPS62906A (ja) * 1985-04-12 1987-01-06 テクトロニツクス・インコ−ポレイテツド 電気光変換装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3458780A (en) * 1967-09-27 1969-07-29 Westinghouse Electric Corp Wedge bonded leads for semiconductor devices

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3458780A (en) * 1967-09-27 1969-07-29 Westinghouse Electric Corp Wedge bonded leads for semiconductor devices

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53102382U (enrdf_load_stackoverflow) * 1977-01-21 1978-08-18
JPS6136709A (ja) * 1984-07-30 1986-02-21 Nec Corp 光フアイバ−結合装置
JPS62906A (ja) * 1985-04-12 1987-01-06 テクトロニツクス・インコ−ポレイテツド 電気光変換装置

Also Published As

Publication number Publication date
JPS5410846Y2 (enrdf_load_stackoverflow) 1979-05-17

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