JPS5134371U - - Google Patents

Info

Publication number
JPS5134371U
JPS5134371U JP1974107282U JP10728274U JPS5134371U JP S5134371 U JPS5134371 U JP S5134371U JP 1974107282 U JP1974107282 U JP 1974107282U JP 10728274 U JP10728274 U JP 10728274U JP S5134371 U JPS5134371 U JP S5134371U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1974107282U
Other languages
Japanese (ja)
Other versions
JPS5623892Y2 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1974107282U priority Critical patent/JPS5623892Y2/ja
Priority to DE19752539604 priority patent/DE2539604A1/de
Publication of JPS5134371U publication Critical patent/JPS5134371U/ja
Application granted granted Critical
Publication of JPS5623892Y2 publication Critical patent/JPS5623892Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G04—HOROLOGY
    • G04G—ELECTRONIC TIME-PIECES
    • G04G17/00—Structural details; Housings
    • G04G17/02—Component assemblies
    • G04G17/04—Mounting of electronic components
    • G—PHYSICS
    • G04—HOROLOGY
    • G04C—ELECTROMECHANICAL CLOCKS OR WATCHES
    • G04C10/00—Arrangements of electric power supplies in time pieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05553—Shape in top view being rectangular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Electric Clocks (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Electromechanical Clocks (AREA)
JP1974107282U 1974-09-06 1974-09-06 Expired JPS5623892Y2 (enrdf_load_stackoverflow)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1974107282U JPS5623892Y2 (enrdf_load_stackoverflow) 1974-09-06 1974-09-06
DE19752539604 DE2539604A1 (de) 1974-09-06 1975-09-05 Integrierte schaltungseinheit fuer eine elektrische uhr

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1974107282U JPS5623892Y2 (enrdf_load_stackoverflow) 1974-09-06 1974-09-06

Publications (2)

Publication Number Publication Date
JPS5134371U true JPS5134371U (enrdf_load_stackoverflow) 1976-03-13
JPS5623892Y2 JPS5623892Y2 (enrdf_load_stackoverflow) 1981-06-04

Family

ID=14455112

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1974107282U Expired JPS5623892Y2 (enrdf_load_stackoverflow) 1974-09-06 1974-09-06

Country Status (2)

Country Link
JP (1) JPS5623892Y2 (enrdf_load_stackoverflow)
DE (1) DE2539604A1 (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3427908C2 (de) * 1984-07-28 1986-10-02 Gebrüder Junghans GmbH, 7230 Schramberg Verfahren zum Herstellen des Schaltungsträgers eines elektromechanischen Uhrwerks und nach solchem Verfahren herstellbarer Schaltungsträger
US4796239A (en) * 1986-05-08 1989-01-03 Seikosha Co., Ltd. Circuit unit for timepiece and process for fabricating the same
CH680252B5 (enrdf_load_stackoverflow) * 1990-08-21 1993-01-29 Ebauchesfabrik Eta Ag

Also Published As

Publication number Publication date
JPS5623892Y2 (enrdf_load_stackoverflow) 1981-06-04
DE2539604A1 (de) 1976-03-25

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