JPS5133990A - - Google Patents
Info
- Publication number
- JPS5133990A JPS5133990A JP49106662A JP10666274A JPS5133990A JP S5133990 A JPS5133990 A JP S5133990A JP 49106662 A JP49106662 A JP 49106662A JP 10666274 A JP10666274 A JP 10666274A JP S5133990 A JPS5133990 A JP S5133990A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
Landscapes
- Electrodes Of Semiconductors (AREA)
- Wire Bonding (AREA)
- Semiconductor Lasers (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP49106662A JPS5133990A (ja) | 1974-09-18 | 1974-09-18 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP49106662A JPS5133990A (ja) | 1974-09-18 | 1974-09-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5133990A true JPS5133990A (ja) | 1976-03-23 |
Family
ID=14439286
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP49106662A Pending JPS5133990A (ja) | 1974-09-18 | 1974-09-18 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5133990A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58201388A (ja) * | 1982-05-20 | 1983-11-24 | Matsushita Electric Ind Co Ltd | 半導体装置 |
US5508562A (en) * | 1992-12-08 | 1996-04-16 | Murata Manufacturing Co., Ltd. | Outer electrode structure for a chip type electronic part appropriate for reflow soldering |
-
1974
- 1974-09-18 JP JP49106662A patent/JPS5133990A/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58201388A (ja) * | 1982-05-20 | 1983-11-24 | Matsushita Electric Ind Co Ltd | 半導体装置 |
US5508562A (en) * | 1992-12-08 | 1996-04-16 | Murata Manufacturing Co., Ltd. | Outer electrode structure for a chip type electronic part appropriate for reflow soldering |