JPS5133990A - - Google Patents

Info

Publication number
JPS5133990A
JPS5133990A JP49106662A JP10666274A JPS5133990A JP S5133990 A JPS5133990 A JP S5133990A JP 49106662 A JP49106662 A JP 49106662A JP 10666274 A JP10666274 A JP 10666274A JP S5133990 A JPS5133990 A JP S5133990A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP49106662A
Inventor
Kimito Takusakawa
Shigeo Oosaka
Kenichi Hori
Shuichi Koyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP49106662A priority Critical patent/JPS5133990A/ja
Publication of JPS5133990A publication Critical patent/JPS5133990A/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01078Platinum [Pt]

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Wire Bonding (AREA)
  • Semiconductor Lasers (AREA)
JP49106662A 1974-09-18 1974-09-18 Pending JPS5133990A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP49106662A JPS5133990A (ja) 1974-09-18 1974-09-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP49106662A JPS5133990A (ja) 1974-09-18 1974-09-18

Publications (1)

Publication Number Publication Date
JPS5133990A true JPS5133990A (ja) 1976-03-23

Family

ID=14439286

Family Applications (1)

Application Number Title Priority Date Filing Date
JP49106662A Pending JPS5133990A (ja) 1974-09-18 1974-09-18

Country Status (1)

Country Link
JP (1) JPS5133990A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58201388A (ja) * 1982-05-20 1983-11-24 Matsushita Electric Ind Co Ltd 半導体装置
US5508562A (en) * 1992-12-08 1996-04-16 Murata Manufacturing Co., Ltd. Outer electrode structure for a chip type electronic part appropriate for reflow soldering

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58201388A (ja) * 1982-05-20 1983-11-24 Matsushita Electric Ind Co Ltd 半導体装置
US5508562A (en) * 1992-12-08 1996-04-16 Murata Manufacturing Co., Ltd. Outer electrode structure for a chip type electronic part appropriate for reflow soldering

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