JPS5133563A - Fuirumuriidono seizohoho - Google Patents

Fuirumuriidono seizohoho

Info

Publication number
JPS5133563A
JPS5133563A JP49101084A JP10108474A JPS5133563A JP S5133563 A JPS5133563 A JP S5133563A JP 49101084 A JP49101084 A JP 49101084A JP 10108474 A JP10108474 A JP 10108474A JP S5133563 A JPS5133563 A JP S5133563A
Authority
JP
Japan
Prior art keywords
fuirumuriidono
seizohoho
fuirumuriidono seizohoho
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP49101084A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5544457B2 (US06650917-20031118-M00005.png
Inventor
Masahide Ogawa
Isamu Kitahiro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP49101084A priority Critical patent/JPS5133563A/ja
Publication of JPS5133563A publication Critical patent/JPS5133563A/ja
Publication of JPS5544457B2 publication Critical patent/JPS5544457B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector

Landscapes

  • Laminated Bodies (AREA)
  • Wire Bonding (AREA)
JP49101084A 1974-09-03 1974-09-03 Fuirumuriidono seizohoho Granted JPS5133563A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP49101084A JPS5133563A (en) 1974-09-03 1974-09-03 Fuirumuriidono seizohoho

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP49101084A JPS5133563A (en) 1974-09-03 1974-09-03 Fuirumuriidono seizohoho

Publications (2)

Publication Number Publication Date
JPS5133563A true JPS5133563A (en) 1976-03-22
JPS5544457B2 JPS5544457B2 (US06650917-20031118-M00005.png) 1980-11-12

Family

ID=14291220

Family Applications (1)

Application Number Title Priority Date Filing Date
JP49101084A Granted JPS5133563A (en) 1974-09-03 1974-09-03 Fuirumuriidono seizohoho

Country Status (1)

Country Link
JP (1) JPS5133563A (US06650917-20031118-M00005.png)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55115344A (en) * 1979-02-28 1980-09-05 Hitachi Ltd Method of forming projected electrode
JPS59164390A (ja) * 1983-02-28 1984-09-17 エア・プロダクツ・アンド・ケミカルズ・インコ−ポレイテツド 重質炭化水素油および残油の水素添加液化法

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56127915U (US06650917-20031118-M00005.png) * 1980-02-29 1981-09-29
JPS58170094U (ja) * 1982-05-07 1983-11-12 クラリオン株式会社 録音再生信号によるタイミング表示装置
JPS58193394U (ja) * 1982-06-17 1983-12-22 パイオニア株式会社 カラオケビデオ装置
JPS5942604A (ja) * 1982-08-31 1984-03-09 Sony Corp 情報再生装置
JPS5942603A (ja) * 1982-08-31 1984-03-09 Sony Corp 記録媒体
JPS5982387U (ja) * 1982-11-27 1984-06-04 三洋電機株式会社 デイスク再生装置
JPS6026996A (ja) * 1983-07-25 1985-02-09 松下電器産業株式会社 演奏装置
JPS6349619U (US06650917-20031118-M00005.png) * 1986-09-19 1988-04-04

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55115344A (en) * 1979-02-28 1980-09-05 Hitachi Ltd Method of forming projected electrode
JPS59164390A (ja) * 1983-02-28 1984-09-17 エア・プロダクツ・アンド・ケミカルズ・インコ−ポレイテツド 重質炭化水素油および残油の水素添加液化法

Also Published As

Publication number Publication date
JPS5544457B2 (US06650917-20031118-M00005.png) 1980-11-12

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