JPS5132275A - - Google Patents
Info
- Publication number
- JPS5132275A JPS5132275A JP49104987A JP10498774A JPS5132275A JP S5132275 A JPS5132275 A JP S5132275A JP 49104987 A JP49104987 A JP 49104987A JP 10498774 A JP10498774 A JP 10498774A JP S5132275 A JPS5132275 A JP S5132275A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49104987A JPS5132275A (enrdf_load_stackoverflow) | 1974-09-13 | 1974-09-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49104987A JPS5132275A (enrdf_load_stackoverflow) | 1974-09-13 | 1974-09-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5132275A true JPS5132275A (enrdf_load_stackoverflow) | 1976-03-18 |
Family
ID=14395429
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP49104987A Pending JPS5132275A (enrdf_load_stackoverflow) | 1974-09-13 | 1974-09-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5132275A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62291934A (ja) * | 1986-06-12 | 1987-12-18 | Alps Electric Co Ltd | フリツプチツプの実装方法 |
| JPH0360138A (ja) * | 1989-07-28 | 1991-03-15 | Nec Kansai Ltd | ボンディング方法 |
| JP2016503235A (ja) * | 2012-12-18 | 2016-02-01 | ネーデルランセ オルハニサチエ フォール トゥーヘパスト−ナツールウェーテンシャッペルック オンデルズク テーエヌオーＮｅｄｅｒｌａｎｄｓｅ Ｏｒｇａｎｉｓａｔｉｅ ｖｏｏｒ ｔｏｅｇｅｐａｓｔ−ｎａｔｕｕｒｗｅｔｅｎｓｃｈａｐｐｅｌｉｊｋ ｏｎｄｅｒｚｏｅｋ ＴＮＯ | 組み込まれた硬化ゾーン中の熱硬化性材料を硬化させること |
-
1974
- 1974-09-13 JP JP49104987A patent/JPS5132275A/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62291934A (ja) * | 1986-06-12 | 1987-12-18 | Alps Electric Co Ltd | フリツプチツプの実装方法 |
| JPH0360138A (ja) * | 1989-07-28 | 1991-03-15 | Nec Kansai Ltd | ボンディング方法 |
| JP2016503235A (ja) * | 2012-12-18 | 2016-02-01 | ネーデルランセ オルハニサチエ フォール トゥーヘパスト−ナツールウェーテンシャッペルック オンデルズク テーエヌオーＮｅｄｅｒｌａｎｄｓｅ Ｏｒｇａｎｉｓａｔｉｅ ｖｏｏｒ ｔｏｅｇｅｐａｓｔ−ｎａｔｕｕｒｗｅｔｅｎｓｃｈａｐｐｅｌｉｊｋ ｏｎｄｅｒｚｏｅｋ ＴＮＯ | 組み込まれた硬化ゾーン中の熱硬化性材料を硬化させること |