JPS5131187B2 - - Google Patents
Info
- Publication number
- JPS5131187B2 JPS5131187B2 JP47050724A JP5072472A JPS5131187B2 JP S5131187 B2 JPS5131187 B2 JP S5131187B2 JP 47050724 A JP47050724 A JP 47050724A JP 5072472 A JP5072472 A JP 5072472A JP S5131187 B2 JPS5131187 B2 JP S5131187B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/015—Manufacture or treatment of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47050724A JPS5131187B2 (https=) | 1972-05-24 | 1972-05-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47050724A JPS5131187B2 (https=) | 1972-05-24 | 1972-05-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4910671A JPS4910671A (https=) | 1974-01-30 |
| JPS5131187B2 true JPS5131187B2 (https=) | 1976-09-04 |
Family
ID=12866803
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP47050724A Expired JPS5131187B2 (https=) | 1972-05-24 | 1972-05-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5131187B2 (https=) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5753350B2 (https=) * | 1973-02-09 | 1982-11-12 | ||
| JPS5435655Y2 (https=) * | 1974-05-08 | 1979-10-29 | ||
| JPS54145678A (en) * | 1978-04-17 | 1979-11-14 | Sumitomo Chem Co Ltd | Benzothiadiazine derivative, its preparation, and herbicides comprising it |
| JPS58155744A (ja) * | 1982-03-12 | 1983-09-16 | Hitachi Ltd | 金属キヤツプのはんだ接続方法 |
| JPS58140792U (ja) * | 1982-03-19 | 1983-09-21 | 東洋電機製造株式会社 | ドラム形ｘ・ｙプロツタのバキユ−ムコラム装置 |
| JPS6248673A (ja) * | 1986-04-30 | 1987-03-03 | Sumitomo Chem Co Ltd | ベンゾチアジン誘導体およびその製法 |
| JPH0730058B2 (ja) * | 1988-05-14 | 1995-04-05 | 参天製薬株式会社 | ３−オキソ−１，４−ベンゾチアジン誘導体 |
-
1972
- 1972-05-24 JP JP47050724A patent/JPS5131187B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4910671A (https=) | 1974-01-30 |