JPS5131187B2 - - Google Patents
Info
- Publication number
- JPS5131187B2 JPS5131187B2 JP47050724A JP5072472A JPS5131187B2 JP S5131187 B2 JPS5131187 B2 JP S5131187B2 JP 47050724 A JP47050724 A JP 47050724A JP 5072472 A JP5072472 A JP 5072472A JP S5131187 B2 JPS5131187 B2 JP S5131187B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
- H01L2224/78308—Removable capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85009—Pre-treatment of the connector or the bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47050724A JPS5131187B2 (ar) | 1972-05-24 | 1972-05-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47050724A JPS5131187B2 (ar) | 1972-05-24 | 1972-05-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4910671A JPS4910671A (ar) | 1974-01-30 |
| JPS5131187B2 true JPS5131187B2 (ar) | 1976-09-04 |
Family
ID=12866803
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP47050724A Expired JPS5131187B2 (ar) | 1972-05-24 | 1972-05-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5131187B2 (ar) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5753350B2 (ar) * | 1973-02-09 | 1982-11-12 | ||
| JPS5435655Y2 (ar) * | 1974-05-08 | 1979-10-29 | ||
| JPS54145678A (en) * | 1978-04-17 | 1979-11-14 | Sumitomo Chem Co Ltd | Benzothiadiazine derivative, its preparation, and herbicides comprising it |
| JPS58155744A (ja) * | 1982-03-12 | 1983-09-16 | Hitachi Ltd | 金属キヤツプのはんだ接続方法 |
| JPS58140792U (ja) * | 1982-03-19 | 1983-09-21 | 東洋電機製造株式会社 | ドラム形ｘ・ｙプロツタのバキユ−ムコラム装置 |
| JPS6248673A (ja) * | 1986-04-30 | 1987-03-03 | Sumitomo Chem Co Ltd | ベンゾチアジン誘導体およびその製法 |
| JPH0730058B2 (ja) * | 1988-05-14 | 1995-04-05 | 参天製薬株式会社 | ３−オキソ−１，４−ベンゾチアジン誘導体 |
-
1972
- 1972-05-24 JP JP47050724A patent/JPS5131187B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4910671A (ar) | 1974-01-30 |