JPS5128497B2 - - Google Patents

Info

Publication number
JPS5128497B2
JPS5128497B2 JP47000090A JP9072A JPS5128497B2 JP S5128497 B2 JPS5128497 B2 JP S5128497B2 JP 47000090 A JP47000090 A JP 47000090A JP 9072 A JP9072 A JP 9072A JP S5128497 B2 JPS5128497 B2 JP S5128497B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP47000090A
Other languages
Japanese (ja)
Other versions
JPS4873077A (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP47000090A priority Critical patent/JPS5128497B2/ja
Publication of JPS4873077A publication Critical patent/JPS4873077A/ja
Publication of JPS5128497B2 publication Critical patent/JPS5128497B2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Dicing (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP47000090A 1971-12-29 1971-12-29 Expired JPS5128497B2 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP47000090A JPS5128497B2 (https=) 1971-12-29 1971-12-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP47000090A JPS5128497B2 (https=) 1971-12-29 1971-12-29

Publications (2)

Publication Number Publication Date
JPS4873077A JPS4873077A (https=) 1973-10-02
JPS5128497B2 true JPS5128497B2 (https=) 1976-08-19

Family

ID=11464408

Family Applications (1)

Application Number Title Priority Date Filing Date
JP47000090A Expired JPS5128497B2 (https=) 1971-12-29 1971-12-29

Country Status (1)

Country Link
JP (1) JPS5128497B2 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53106672U (https=) * 1977-02-01 1978-08-26
JPH02100340A (ja) * 1988-10-06 1990-04-12 Nec Corp 半導体装置の製造方法

Also Published As

Publication number Publication date
JPS4873077A (https=) 1973-10-02

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