JPS5117802Y2 - - Google Patents
Info
- Publication number
- JPS5117802Y2 JPS5117802Y2 JP1972091157U JP9115772U JPS5117802Y2 JP S5117802 Y2 JPS5117802 Y2 JP S5117802Y2 JP 1972091157 U JP1972091157 U JP 1972091157U JP 9115772 U JP9115772 U JP 9115772U JP S5117802 Y2 JPS5117802 Y2 JP S5117802Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/461—Leadframes specially adapted for cooling
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/421—Shapes or dispositions
- H10W70/424—Cross-sectional shapes
- H10W70/427—Bent parts
- H10W70/429—Bent parts being the outer leads
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Packaging Frangible Articles (AREA)
- Packages (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT2255671 | 1971-08-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4835270U JPS4835270U (online.php) | 1973-04-27 |
| JPS5117802Y2 true JPS5117802Y2 (online.php) | 1976-05-13 |
Family
ID=11197792
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1972091157U Expired JPS5117802Y2 (online.php) | 1971-08-25 | 1972-08-02 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPS5117802Y2 (online.php) |
| DE (1) | DE7146448U (online.php) |
| ES (1) | ES176333Y (online.php) |
| FR (1) | FR2124753A7 (online.php) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3430849A1 (de) * | 1984-08-22 | 1986-03-06 | Gerd 7742 St Georgen Kammerer | Verfahren zur raeumlichen ausweitung der elektrischen verbindung zwischen den anschlusskontakten hochintegrierter elektronischer bauelemente und den kontaktstellen einer elektrischen anschlussvorrichtung auf einem bauelementetraeger |
-
1971
- 1971-12-09 DE DE19717146448U patent/DE7146448U/de not_active Expired
- 1971-12-28 ES ES1971176333U patent/ES176333Y/es not_active Expired
-
1972
- 1972-01-14 FR FR7201332A patent/FR2124753A7/fr not_active Expired
- 1972-08-02 JP JP1972091157U patent/JPS5117802Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| ES176333U (es) | 1972-08-01 |
| JPS4835270U (online.php) | 1973-04-27 |
| ES176333Y (es) | 1973-02-01 |
| FR2124753A7 (online.php) | 1972-09-22 |
| DE7146448U (de) | 1972-08-17 |