JPS5116877A - - Google Patents

Info

Publication number
JPS5116877A
JPS5116877A JP49088355A JP8835574A JPS5116877A JP S5116877 A JPS5116877 A JP S5116877A JP 49088355 A JP49088355 A JP 49088355A JP 8835574 A JP8835574 A JP 8835574A JP S5116877 A JPS5116877 A JP S5116877A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP49088355A
Other versions
JPS523275B2 (ja
Inventor
Masao Hayakawa
Takamichi Maeda
Morihiro Yoshida
Masao Kumura
Masahiro Nomura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP49088355A priority Critical patent/JPS523275B2/ja
Publication of JPS5116877A publication Critical patent/JPS5116877A/ja
Publication of JPS523275B2 publication Critical patent/JPS523275B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
JP49088355A 1974-07-31 1974-07-31 Expired JPS523275B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP49088355A JPS523275B2 (ja) 1974-07-31 1974-07-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP49088355A JPS523275B2 (ja) 1974-07-31 1974-07-31

Publications (2)

Publication Number Publication Date
JPS5116877A true JPS5116877A (ja) 1976-02-10
JPS523275B2 JPS523275B2 (ja) 1977-01-27

Family

ID=13940496

Family Applications (1)

Application Number Title Priority Date Filing Date
JP49088355A Expired JPS523275B2 (ja) 1974-07-31 1974-07-31

Country Status (1)

Country Link
JP (1) JPS523275B2 (ja)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5333892A (en) * 1976-09-03 1978-03-30 Mitsui Miike Machinery Co Ltd Bait supplier for fish culture
JPS5441671A (en) * 1977-09-08 1979-04-03 Sharp Corp Semiconductor device
JPS5455270U (ja) * 1977-09-22 1979-04-17
JPS56150835A (en) * 1980-03-24 1981-11-21 Nat Semiconductor Corp Method of packaging tape-operated semiconductor device
JPS57135744U (ja) * 1981-02-20 1982-08-24
JPS63190363A (ja) * 1987-02-02 1988-08-05 Matsushita Electronics Corp パワ−パツケ−ジ
JPS6442828A (en) * 1987-08-10 1989-02-15 Rohm Co Ltd Semiconductor device
JPH01214032A (ja) * 1988-02-22 1989-08-28 Canon Inc 電気回路装置
JPH03125440A (ja) * 1989-10-09 1991-05-28 Rohm Co Ltd 電子部品
JPH04307760A (ja) * 1991-04-04 1992-10-29 Mitsubishi Electric Corp 樹脂封止形半導体装置

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5333892A (en) * 1976-09-03 1978-03-30 Mitsui Miike Machinery Co Ltd Bait supplier for fish culture
JPS5441671A (en) * 1977-09-08 1979-04-03 Sharp Corp Semiconductor device
JPS5716738B2 (ja) * 1977-09-08 1982-04-07
JPS5910753Y2 (ja) * 1977-09-22 1984-04-04 シャープ株式会社 半導体装置
JPS5455270U (ja) * 1977-09-22 1979-04-17
JPS56150835A (en) * 1980-03-24 1981-11-21 Nat Semiconductor Corp Method of packaging tape-operated semiconductor device
JPH0115140B2 (ja) * 1980-03-24 1989-03-15 Nat Semiconductor Corp
JPS57135744U (ja) * 1981-02-20 1982-08-24
JPS629723Y2 (ja) * 1981-02-20 1987-03-06
JPS63190363A (ja) * 1987-02-02 1988-08-05 Matsushita Electronics Corp パワ−パツケ−ジ
JPS6442828A (en) * 1987-08-10 1989-02-15 Rohm Co Ltd Semiconductor device
JPH0533825B2 (ja) * 1987-08-10 1993-05-20 Rohm Kk
JPH01214032A (ja) * 1988-02-22 1989-08-28 Canon Inc 電気回路装置
JPH03125440A (ja) * 1989-10-09 1991-05-28 Rohm Co Ltd 電子部品
JPH04307760A (ja) * 1991-04-04 1992-10-29 Mitsubishi Electric Corp 樹脂封止形半導体装置

Also Published As

Publication number Publication date
JPS523275B2 (ja) 1977-01-27

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