JPS5116109B2 - - Google Patents

Info

Publication number
JPS5116109B2
JPS5116109B2 JP46071182A JP7118271A JPS5116109B2 JP S5116109 B2 JPS5116109 B2 JP S5116109B2 JP 46071182 A JP46071182 A JP 46071182A JP 7118271 A JP7118271 A JP 7118271A JP S5116109 B2 JPS5116109 B2 JP S5116109B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP46071182A
Other languages
Japanese (ja)
Other versions
JPS4838071A (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP46071182A priority Critical patent/JPS5116109B2/ja
Publication of JPS4838071A publication Critical patent/JPS4838071A/ja
Publication of JPS5116109B2 publication Critical patent/JPS5116109B2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Sheets, Magazines, And Separation Thereof (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP46071182A 1971-09-16 1971-09-16 Expired JPS5116109B2 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP46071182A JPS5116109B2 (https=) 1971-09-16 1971-09-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP46071182A JPS5116109B2 (https=) 1971-09-16 1971-09-16

Publications (2)

Publication Number Publication Date
JPS4838071A JPS4838071A (https=) 1973-06-05
JPS5116109B2 true JPS5116109B2 (https=) 1976-05-21

Family

ID=13453243

Family Applications (1)

Application Number Title Priority Date Filing Date
JP46071182A Expired JPS5116109B2 (https=) 1971-09-16 1971-09-16

Country Status (1)

Country Link
JP (1) JPS5116109B2 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50130669A (https=) * 1974-04-04 1975-10-16
US4063440A (en) * 1976-04-16 1977-12-20 Mesta Machine Company Quick-change coiler assembly for strip mills and the like
JPS5630405Y2 (https=) * 1976-08-05 1981-07-20
CH635546A5 (fr) * 1979-04-24 1983-04-15 Speno International Procede pour materialiser optiquement au moins une categorie de defauts geometriques d'une voie ferree et dispositif pour la mise en oeuvre de ce procede.
JPS5645054A (en) * 1979-09-21 1981-04-24 Hitachi Ltd Resin sealing semiconductor device

Also Published As

Publication number Publication date
JPS4838071A (https=) 1973-06-05

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