JPS5116109B2 - - Google Patents
Info
- Publication number
- JPS5116109B2 JPS5116109B2 JP46071182A JP7118271A JPS5116109B2 JP S5116109 B2 JPS5116109 B2 JP S5116109B2 JP 46071182 A JP46071182 A JP 46071182A JP 7118271 A JP7118271 A JP 7118271A JP S5116109 B2 JPS5116109 B2 JP S5116109B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Sheets, Magazines, And Separation Thereof (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP46071182A JPS5116109B2 (es) | 1971-09-16 | 1971-09-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP46071182A JPS5116109B2 (es) | 1971-09-16 | 1971-09-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4838071A JPS4838071A (es) | 1973-06-05 |
| JPS5116109B2 true JPS5116109B2 (es) | 1976-05-21 |
Family
ID=13453243
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP46071182A Expired JPS5116109B2 (es) | 1971-09-16 | 1971-09-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5116109B2 (es) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5414804Y2 (es) * | 1974-10-30 | 1979-06-18 |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50130669A (es) * | 1974-04-04 | 1975-10-16 | ||
| US4063440A (en) * | 1976-04-16 | 1977-12-20 | Mesta Machine Company | Quick-change coiler assembly for strip mills and the like |
| JPS5630405Y2 (es) * | 1976-08-05 | 1981-07-20 | ||
| CH635546A5 (fr) * | 1979-04-24 | 1983-04-15 | Speno International | Procede pour materialiser optiquement au moins une categorie de defauts geometriques d'une voie ferree et dispositif pour la mise en oeuvre de ce procede. |
| JPS5645054A (en) * | 1979-09-21 | 1981-04-24 | Hitachi Ltd | Resin sealing semiconductor device |
-
1971
- 1971-09-16 JP JP46071182A patent/JPS5116109B2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5414804Y2 (es) * | 1974-10-30 | 1979-06-18 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4838071A (es) | 1973-06-05 |