JPS51152957U - - Google Patents
Info
- Publication number
- JPS51152957U JPS51152957U JP7202875U JP7202875U JPS51152957U JP S51152957 U JPS51152957 U JP S51152957U JP 7202875 U JP7202875 U JP 7202875U JP 7202875 U JP7202875 U JP 7202875U JP S51152957 U JPS51152957 U JP S51152957U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Casings For Electric Apparatus (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7202875U JPS51152957U (en。) | 1975-05-30 | 1975-05-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7202875U JPS51152957U (en。) | 1975-05-30 | 1975-05-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS51152957U true JPS51152957U (en。) | 1976-12-06 |
Family
ID=28542974
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7202875U Pending JPS51152957U (en。) | 1975-05-30 | 1975-05-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS51152957U (en。) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016134492A (ja) * | 2015-01-19 | 2016-07-25 | 新電元工業株式会社 | 半導体装置、半導体装置の製造方法、および半導体装置の実装方法 |
| JP2017059846A (ja) * | 2016-11-24 | 2017-03-23 | 三菱電機株式会社 | パワーモジュールの製造方法 |
| CN107039388A (zh) * | 2013-12-02 | 2017-08-11 | 三菱电机株式会社 | 功率模块的制造方法 |
-
1975
- 1975-05-30 JP JP7202875U patent/JPS51152957U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107039388A (zh) * | 2013-12-02 | 2017-08-11 | 三菱电机株式会社 | 功率模块的制造方法 |
| US10332869B2 (en) | 2013-12-02 | 2019-06-25 | Mitsubishi Electric Corporation | Method for manufacturing power module |
| JP2016134492A (ja) * | 2015-01-19 | 2016-07-25 | 新電元工業株式会社 | 半導体装置、半導体装置の製造方法、および半導体装置の実装方法 |
| JP2017059846A (ja) * | 2016-11-24 | 2017-03-23 | 三菱電機株式会社 | パワーモジュールの製造方法 |