JPS5114557U - - Google Patents

Info

Publication number
JPS5114557U
JPS5114557U JP1974085026U JP8502674U JPS5114557U JP S5114557 U JPS5114557 U JP S5114557U JP 1974085026 U JP1974085026 U JP 1974085026U JP 8502674 U JP8502674 U JP 8502674U JP S5114557 U JPS5114557 U JP S5114557U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1974085026U
Other languages
Japanese (ja)
Other versions
JPS5313346Y2 (id
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1974085026U priority Critical patent/JPS5313346Y2/ja
Publication of JPS5114557U publication Critical patent/JPS5114557U/ja
Application granted granted Critical
Publication of JPS5313346Y2 publication Critical patent/JPS5313346Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H01L2224/78621—Holding means, e.g. wire clampers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP1974085026U 1974-07-19 1974-07-19 Expired JPS5313346Y2 (id)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1974085026U JPS5313346Y2 (id) 1974-07-19 1974-07-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1974085026U JPS5313346Y2 (id) 1974-07-19 1974-07-19

Publications (2)

Publication Number Publication Date
JPS5114557U true JPS5114557U (id) 1976-02-02
JPS5313346Y2 JPS5313346Y2 (id) 1978-04-11

Family

ID=28266724

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1974085026U Expired JPS5313346Y2 (id) 1974-07-19 1974-07-19

Country Status (1)

Country Link
JP (1) JPS5313346Y2 (id)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53160872U (id) * 1977-05-23 1978-12-16
JPS54131184A (en) * 1978-04-04 1979-10-12 Nippon Kokan Kk <Nkk> Plug tightener for coupling tube ends
JPS5993828U (ja) * 1982-12-11 1984-06-26 株式会社タチエス ワイヤ−へのナツト自動締付装置
JPS59160121U (ja) * 1983-03-09 1984-10-26 マツダ株式会社 フロントアクスル組付治具
JPS618239A (ja) * 1984-06-25 1986-01-14 Kawasaki Steel Corp 管端プロテクタの自動装着装置

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53160872U (id) * 1977-05-23 1978-12-16
JPS54131184A (en) * 1978-04-04 1979-10-12 Nippon Kokan Kk <Nkk> Plug tightener for coupling tube ends
JPS5816977B2 (ja) * 1978-04-04 1983-04-04 日本鋼管株式会社 管端カップリング用プラグ螺着装置
JPS5993828U (ja) * 1982-12-11 1984-06-26 株式会社タチエス ワイヤ−へのナツト自動締付装置
JPS6320520Y2 (id) * 1982-12-11 1988-06-07
JPS59160121U (ja) * 1983-03-09 1984-10-26 マツダ株式会社 フロントアクスル組付治具
JPS6346201Y2 (id) * 1983-03-09 1988-12-01
JPS618239A (ja) * 1984-06-25 1986-01-14 Kawasaki Steel Corp 管端プロテクタの自動装着装置

Also Published As

Publication number Publication date
JPS5313346Y2 (id) 1978-04-11

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