JPS51137991A - Wire guide roller for use in cutting brittle substances - Google Patents

Wire guide roller for use in cutting brittle substances

Info

Publication number
JPS51137991A
JPS51137991A JP6220675A JP6220675A JPS51137991A JP S51137991 A JPS51137991 A JP S51137991A JP 6220675 A JP6220675 A JP 6220675A JP 6220675 A JP6220675 A JP 6220675A JP S51137991 A JPS51137991 A JP S51137991A
Authority
JP
Japan
Prior art keywords
guide roller
wire guide
cutting brittle
brittle substances
substances
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6220675A
Other languages
Japanese (ja)
Inventor
Isao Yamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KITSUDA KK
Original Assignee
KITSUDA KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KITSUDA KK filed Critical KITSUDA KK
Priority to JP6220675A priority Critical patent/JPS51137991A/en
Publication of JPS51137991A publication Critical patent/JPS51137991A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/003—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
    • B23D57/0053—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts of drives for saw wires; of wheel mountings; of wheels

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

PURPOSE:To make practicable the cutting of an object to be processed into an even thickness.
JP6220675A 1975-05-24 1975-05-24 Wire guide roller for use in cutting brittle substances Pending JPS51137991A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6220675A JPS51137991A (en) 1975-05-24 1975-05-24 Wire guide roller for use in cutting brittle substances

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6220675A JPS51137991A (en) 1975-05-24 1975-05-24 Wire guide roller for use in cutting brittle substances

Publications (1)

Publication Number Publication Date
JPS51137991A true JPS51137991A (en) 1976-11-29

Family

ID=13193427

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6220675A Pending JPS51137991A (en) 1975-05-24 1975-05-24 Wire guide roller for use in cutting brittle substances

Country Status (1)

Country Link
JP (1) JPS51137991A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04188749A (en) * 1990-11-22 1992-07-07 Fuji Electric Co Ltd Manufacture of semiconductor device
KR20150115660A (en) * 2014-04-04 2015-10-14 실트로닉 아게 Method for slicing wafers from a workpiece using a sawing wire

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04188749A (en) * 1990-11-22 1992-07-07 Fuji Electric Co Ltd Manufacture of semiconductor device
KR20150115660A (en) * 2014-04-04 2015-10-14 실트로닉 아게 Method for slicing wafers from a workpiece using a sawing wire
JP2015201641A (en) * 2014-04-04 2015-11-12 ジルトロニック アクチエンゲゼルシャフトＳｉｌｔｒｏｎｉｃ ＡＧ Method for slicing wafer from workpiece using sawing wire
US9579826B2 (en) 2014-04-04 2017-02-28 Siltronic Ag Method for slicing wafers from a workpiece using a sawing wire

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