JPS5113619B2 - - Google Patents
Info
- Publication number
- JPS5113619B2 JPS5113619B2 JP47061944A JP6194472A JPS5113619B2 JP S5113619 B2 JPS5113619 B2 JP S5113619B2 JP 47061944 A JP47061944 A JP 47061944A JP 6194472 A JP6194472 A JP 6194472A JP S5113619 B2 JPS5113619 B2 JP S5113619B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
- H10W72/07353—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in shapes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
- H10W72/331—Shapes of die-attach connectors
- H10W72/334—Cross-sectional shape, i.e. in side view
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47061944A JPS5113619B2 (cg-RX-API-DMAC7.html) | 1972-06-20 | 1972-06-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47061944A JPS5113619B2 (cg-RX-API-DMAC7.html) | 1972-06-20 | 1972-06-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4922866A JPS4922866A (cg-RX-API-DMAC7.html) | 1974-02-28 |
| JPS5113619B2 true JPS5113619B2 (cg-RX-API-DMAC7.html) | 1976-05-01 |
Family
ID=13185790
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP47061944A Expired JPS5113619B2 (cg-RX-API-DMAC7.html) | 1972-06-20 | 1972-06-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5113619B2 (cg-RX-API-DMAC7.html) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60217141A (ja) * | 1984-04-12 | 1985-10-30 | 太陽工業株式会社 | 膜面構造物における膜体の粉飾方法及び構造 |
| JPS6128810U (ja) * | 1984-07-26 | 1986-02-21 | 紹栄 新里 | ほろ移動装置 |
| JPH0274415U (cg-RX-API-DMAC7.html) * | 1988-11-29 | 1990-06-07 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50105366U (cg-RX-API-DMAC7.html) * | 1974-02-04 | 1975-08-29 | ||
| JPS5238885A (en) * | 1975-09-22 | 1977-03-25 | Nec Home Electronics Ltd | Method for production of semiconductor device |
| JPS5562047U (cg-RX-API-DMAC7.html) * | 1978-10-18 | 1980-04-26 | ||
| CN104659011A (zh) * | 2013-11-20 | 2015-05-27 | 西安永电电气有限责任公司 | 一种igbt模块的芯片焊接结构 |
-
1972
- 1972-06-20 JP JP47061944A patent/JPS5113619B2/ja not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60217141A (ja) * | 1984-04-12 | 1985-10-30 | 太陽工業株式会社 | 膜面構造物における膜体の粉飾方法及び構造 |
| JPS6128810U (ja) * | 1984-07-26 | 1986-02-21 | 紹栄 新里 | ほろ移動装置 |
| JPH0274415U (cg-RX-API-DMAC7.html) * | 1988-11-29 | 1990-06-07 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4922866A (cg-RX-API-DMAC7.html) | 1974-02-28 |