JPS5113511B1 - - Google Patents

Info

Publication number
JPS5113511B1
JPS5113511B1 JP42048451A JP4845167A JPS5113511B1 JP S5113511 B1 JPS5113511 B1 JP S5113511B1 JP 42048451 A JP42048451 A JP 42048451A JP 4845167 A JP4845167 A JP 4845167A JP S5113511 B1 JPS5113511 B1 JP S5113511B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP42048451A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5113511B1 publication Critical patent/JPS5113511B1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
    • C08G63/12—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
    • C08G63/52—Polycarboxylic acids or polyhydroxy compounds in which at least one of the two components contains aliphatic unsaturation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/003—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised by the matrix material, e.g. material composition or physical properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
    • C08G63/60—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from the reaction of a mixture of hydroxy carboxylic acids, polycarboxylic acids and polyhydroxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/06—Unsaturated polyesters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2309/00—Use of inorganic materials not provided for in groups B29K2303/00 - B29K2307/00, as reinforcement
    • B29K2309/08—Glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y10T428/31616—Next to polyester [e.g., alkyd]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/30—Woven fabric [i.e., woven strand or strip material]
    • Y10T442/3382—Including a free metal or alloy constituent
    • Y10T442/3415—Preformed metallic film or foil or sheet [film or foil or sheet had structural integrity prior to association with the woven fabric]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Composite Materials (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
JP42048451A 1966-07-29 1967-07-28 Pending JPS5113511B1 (OSRAM)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US56875166A 1966-07-29 1966-07-29

Publications (1)

Publication Number Publication Date
JPS5113511B1 true JPS5113511B1 (OSRAM) 1976-04-30

Family

ID=24272581

Family Applications (1)

Application Number Title Priority Date Filing Date
JP42048451A Pending JPS5113511B1 (OSRAM) 1966-07-29 1967-07-28

Country Status (11)

Country Link
US (1) US3477900A (OSRAM)
JP (1) JPS5113511B1 (OSRAM)
AT (1) AT282977B (OSRAM)
BE (1) BE701870A (OSRAM)
CH (1) CH502895A (OSRAM)
DE (1) DE1669854B2 (OSRAM)
DK (1) DK117436B (OSRAM)
ES (1) ES343481A1 (OSRAM)
GB (1) GB1180407A (OSRAM)
NL (2) NL6710375A (OSRAM)
SE (1) SE324392B (OSRAM)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5495817U (OSRAM) * 1977-12-20 1979-07-06
JPS5837782U (ja) * 1981-09-04 1983-03-11 株式会社　セコ−技研 本体に組込みのできる直流電動機

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4101693A (en) * 1971-08-05 1978-07-18 General Electric Company Method of preparing epoxy-glass prepregs
JPS5222380B2 (OSRAM) * 1973-05-30 1977-06-17
AR210463A1 (es) * 1974-02-01 1977-08-15 Dynamit Nobel Ag Material plastico laminado anti-inflamable
US4313995A (en) * 1976-11-08 1982-02-02 Fortin Laminating Corporation Circuit board and method for producing same
DE2659625C3 (de) * 1976-12-30 1981-07-02 Ferrozell-Gesellschaft Sachs & Co Mbh, 8900 Augsburg Verfahren zur Herstellung von Basismaterial zur Herstellung gedruckter Schaltungen
US4420509A (en) * 1981-08-11 1983-12-13 Glasteel Tennessee, Inc. Copper-clad polyester-glass fiber laminates
US4446173A (en) * 1981-08-11 1984-05-01 Glasteel Tennessee, Inc. Copper-clad polyester-glass fiber laminates using zinc-coated copper
IL81157A (en) * 1987-01-05 1990-04-29 Uri Shoshani Decorative products made of plastic having a metallic decorative pattern
US4803022A (en) * 1987-05-06 1989-02-07 Glasteel Industrial Laminates, Inc. Method of continuously bonding and curing a zinc-coated metal-clad polyester-epoxy-glass fiber laminate
US5112462A (en) * 1990-09-13 1992-05-12 Sheldahl Inc. Method of making metal-film laminate resistant to delamination
US5137791A (en) * 1990-09-13 1992-08-11 Sheldahl Inc. Metal-film laminate resistant to delamination
US6060175A (en) * 1990-09-13 2000-05-09 Sheldahl, Inc. Metal-film laminate resistant to delamination
US6165309A (en) * 1998-02-04 2000-12-26 General Electric Co. Method for improving the adhesion of metal films to polyphenylene ether resins
US8790762B2 (en) * 2009-03-25 2014-07-29 Dsm Ip Assets B.V. Unsaturated polyester resin
CN112521559B (zh) * 2020-12-11 2022-05-13 锦西化工研究院有限公司 制备醇酸有机玻璃板材的方法及醇酸有机玻璃板材

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3149021A (en) * 1959-08-10 1964-09-15 Cincinnati Milling Machine Co Panel for printed circuits

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3186898A (en) * 1961-06-15 1965-06-01 Sperry Rand Corp Laminated circuit structure and method of preparing same
US3393117A (en) * 1964-02-13 1968-07-16 Cincinnati Milling Machine Co Copper-clad glass reinforced thermoset resin panel
US3419637A (en) * 1966-06-30 1968-12-31 Ppg Industries Inc Chemical-resistant polyester resins based upon dicyclohexanols and neopentyl glycol-type diols

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3149021A (en) * 1959-08-10 1964-09-15 Cincinnati Milling Machine Co Panel for printed circuits

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5495817U (OSRAM) * 1977-12-20 1979-07-06
JPS5837782U (ja) * 1981-09-04 1983-03-11 株式会社　セコ−技研 本体に組込みのできる直流電動機

Also Published As

Publication number Publication date
ES343481A1 (es) 1968-12-01
DE1669854A1 (de) 1970-10-01
US3477900A (en) 1969-11-11
SE324392B (OSRAM) 1970-06-01
NL6710375A (OSRAM) 1968-01-30
GB1180407A (en) 1970-02-04
BE701870A (OSRAM) 1968-01-26
AT282977B (de) 1970-07-27
CH502895A (de) 1971-02-15
DE1669854B2 (de) 1976-09-09
NL135706C (OSRAM) 1900-01-01
DK117436B (da) 1970-04-27

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