JPS51130449U - - Google Patents
Info
- Publication number
- JPS51130449U JPS51130449U JP1975051802U JP5180275U JPS51130449U JP S51130449 U JPS51130449 U JP S51130449U JP 1975051802 U JP1975051802 U JP 1975051802U JP 5180275 U JP5180275 U JP 5180275U JP S51130449 U JPS51130449 U JP S51130449U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Multi-Conductor Connections (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1975051802U JPS51130449U (en:Method) | 1975-04-15 | 1975-04-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1975051802U JPS51130449U (en:Method) | 1975-04-15 | 1975-04-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS51130449U true JPS51130449U (en:Method) | 1976-10-21 |
Family
ID=28197636
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1975051802U Pending JPS51130449U (en:Method) | 1975-04-15 | 1975-04-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS51130449U (en:Method) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018125413A (ja) * | 2017-02-01 | 2018-08-09 | 日本電気株式会社 | 電子部品および電子部品の製造方法 |
| JP2019153658A (ja) * | 2018-03-02 | 2019-09-12 | 富士通株式会社 | 基板モジュール及び基板モジュールの製造方法 |
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1975
- 1975-04-15 JP JP1975051802U patent/JPS51130449U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018125413A (ja) * | 2017-02-01 | 2018-08-09 | 日本電気株式会社 | 電子部品および電子部品の製造方法 |
| US10334721B2 (en) | 2017-02-01 | 2019-06-25 | Nec Corporation | Electronic component and electronic component manufacturing method |
| JP2019153658A (ja) * | 2018-03-02 | 2019-09-12 | 富士通株式会社 | 基板モジュール及び基板モジュールの製造方法 |