JPS5112778A - Handotaisochi oyobi sonoseizohoho - Google Patents

Handotaisochi oyobi sonoseizohoho

Info

Publication number
JPS5112778A
JPS5112778A JP50072123A JP7212375A JPS5112778A JP S5112778 A JPS5112778 A JP S5112778A JP 50072123 A JP50072123 A JP 50072123A JP 7212375 A JP7212375 A JP 7212375A JP S5112778 A JPS5112778 A JP S5112778A
Authority
JP
Japan
Prior art keywords
handotaisochi
oyobi sonoseizohoho
sonoseizohoho
oyobi
handotaisochi oyobi
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50072123A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5247319B2 (es
Inventor
Arunorudosu Aperusu Yohanesu
Korunerisu Eber Furanshisukasu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of JPS5112778A publication Critical patent/JPS5112778A/ja
Publication of JPS5247319B2 publication Critical patent/JPS5247319B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/08Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
    • H01L27/082Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including bipolar components only
    • H01L27/0823Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including bipolar components only including vertical bipolar transistors only
    • H01L27/0826Combination of vertical complementary transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76Making of isolation regions between components
    • H01L21/761PN junctions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76Making of isolation regions between components
    • H01L21/762Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • H01L21/76264SOI together with lateral isolation, e.g. using local oxidation of silicon, or dielectric or polycristalline material refilled trench or air gap isolation regions, e.g. completely isolated semiconductor islands
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76Making of isolation regions between components
    • H01L21/762Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/76297Dielectric isolation using EPIC techniques, i.e. epitaxial passivated integrated circuit
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/06Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
    • H01L27/0611Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region
    • H01L27/0641Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region without components of the field effect type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76Making of isolation regions between components
    • H01L21/762Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • H01L21/76264SOI together with lateral isolation, e.g. using local oxidation of silicon, or dielectric or polycristalline material refilled trench or air gap isolation regions, e.g. completely isolated semiconductor islands
    • H01L21/76283Lateral isolation by refilling of trenches with dielectric material

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Bipolar Transistors (AREA)
  • Bipolar Integrated Circuits (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
JP50072123A 1974-06-18 1975-06-16 Handotaisochi oyobi sonoseizohoho Granted JPS5112778A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7408110A NL7408110A (nl) 1974-06-18 1974-06-18 Halfgeleiderinrichting met complementaire tran- sistorstrukturen en werkwijze ter vervaardiging daarvan.

Publications (2)

Publication Number Publication Date
JPS5112778A true JPS5112778A (en) 1976-01-31
JPS5247319B2 JPS5247319B2 (es) 1977-12-01

Family

ID=19821569

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50072123A Granted JPS5112778A (en) 1974-06-18 1975-06-16 Handotaisochi oyobi sonoseizohoho

Country Status (13)

Country Link
JP (1) JPS5112778A (es)
AU (1) AU499052B2 (es)
BE (1) BE830286A (es)
BR (1) BR7503777A (es)
CA (1) CA1029134A (es)
CH (1) CH588166A5 (es)
DE (1) DE2525529B2 (es)
ES (1) ES438593A1 (es)
FR (1) FR2275884A1 (es)
GB (1) GB1505103A (es)
IT (1) IT1046053B (es)
NL (1) NL7408110A (es)
SE (1) SE407996B (es)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63128349U (es) * 1987-02-13 1988-08-22
JPS63142451U (es) * 1987-03-12 1988-09-20

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7710164A (nl) * 1977-09-16 1979-03-20 Philips Nv Werkwijze ter behandeling van een eenkristal- lijn lichaam.
US4159915A (en) * 1977-10-25 1979-07-03 International Business Machines Corporation Method for fabrication vertical NPN and PNP structures utilizing ion-implantation
US4232328A (en) * 1978-12-20 1980-11-04 Bell Telephone Laboratories, Incorporated Dielectrically-isolated integrated circuit complementary transistors for high voltage use
GB2060252B (en) * 1979-09-17 1984-02-22 Nippon Telegraph & Telephone Mutually isolated complementary semiconductor elements
JPS57204898A (en) * 1981-06-02 1982-12-15 Saito Masayasu Pump for vessel for dividing liquid little by little
US5070382A (en) * 1989-08-18 1991-12-03 Motorola, Inc. Semiconductor structure for high power integrated circuits
US7076124B2 (en) * 2002-12-20 2006-07-11 Avago Technologies, Ltd. Integrated multichannel laser driver and photodetector receiver
EP4372792A1 (en) * 2022-11-16 2024-05-22 Infineon Technologies Dresden GmbH & Co . KG Semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63128349U (es) * 1987-02-13 1988-08-22
JPS63142451U (es) * 1987-03-12 1988-09-20

Also Published As

Publication number Publication date
AU8214975A (en) 1976-12-23
CH588166A5 (es) 1977-05-31
DE2525529B2 (de) 1977-08-04
BE830286A (fr) 1975-12-16
AU499052B2 (en) 1979-04-05
SE407996B (sv) 1979-04-30
BR7503777A (pt) 1976-07-06
CA1029134A (en) 1978-04-04
GB1505103A (en) 1978-03-22
FR2275884A1 (fr) 1976-01-16
SE7506878L (sv) 1975-12-19
DE2525529A1 (de) 1976-01-08
FR2275884B1 (es) 1980-10-24
ES438593A1 (es) 1977-01-16
JPS5247319B2 (es) 1977-12-01
IT1046053B (it) 1980-06-30
NL7408110A (nl) 1975-12-22

Similar Documents

Publication Publication Date Title
JPS51105837A (en) Kogakusenikeeburu oyobi ketsugosochi
JPS51105891A (en) Enshinbunryosochi byogenseibiseibutsukenshutsuyosochi oyobi kenshutsuhoho
JPS5112999A (en) Makitabako oyobi sonoseizohoho
JPS5111944A (en) Makikomiito oyobi sonoseizohoho
JPS51109597A (en) Hosekikenmano tameno zairyokenmaho oyobi sonosochi
JPS51108529A (en) Kogakutekimemori oyobi hyojihohonarabinisochi
JPS51102009A (en) Yojugarasuseiseiho oyobi garasutankugamasochi
JPS51108514A (en) Onpaketsuzoho oyobi onpaketsuzosochi
JPS51105148A (en) Tairyudanbosochi oyobi sonoseizohoho
JPS5112778A (en) Handotaisochi oyobi sonoseizohoho
JPS5112599A (en) Hojotekinanishiji oyobi mochiagenoryokuojusuruherikoputaa
JPS5110885A (en) Gomusoseibutsuto kinzokuzairyotokaranarufukugotai oyobi sonoseizohoho
JPS51108474A (en) Kontenasosanohoho oyobi sochinokairyo
JPS5110161A (en) Reezayosetsuho oyobi reezayosetsusochi
JPS51108913A (en) Kanatsusei oyobi kannetsuseikirokuzairyo
JPS51102092A (en) Seikeiyokonpaundo oyobi seikeiseihin
JPS5110415A (en) Nijukakutankuno naisoteibanbuno roeikensahoho oyobi sonosochi
JPS51110797A (en) Nokobanosetsutohoho oyobi sonosochi
JPS5113054A (en) Borutobu oyobi natsutobuno fushokuboshihoho
JPS5111946A (en) Kasadakakakoshi oyobi sonoseizo
JPS511247A (en) Jokiatsuryoku oyobi ondoryonyoru mokuzaino hakuhihoho
JPS5112520A (en) Sharyonohekimen senronadono ketsugohoho oyobi korenimochiiru burotsukuzai
JPS5110806A (en) Kogyoyooiru oyobi sonoseizohoho
JPS5112387A (en) Ekitai oyobi nyuekifunmatsukaho
JPS5112334A (en) Yojumetsukino gasuwaipinguhoho oyobi sonosochi