JPS51119651A - Stannummmagnesiummzinc soft solder material - Google Patents
Stannummmagnesiummzinc soft solder materialInfo
- Publication number
- JPS51119651A JPS51119651A JP4432075A JP4432075A JPS51119651A JP S51119651 A JPS51119651 A JP S51119651A JP 4432075 A JP4432075 A JP 4432075A JP 4432075 A JP4432075 A JP 4432075A JP S51119651 A JPS51119651 A JP S51119651A
- Authority
- JP
- Japan
- Prior art keywords
- stannummmagnesiummzinc
- solder material
- soft solder
- soft
- stannummmagnesiummzinc soft
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 title 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4432075A JPS51119651A (en) | 1975-04-14 | 1975-04-14 | Stannummmagnesiummzinc soft solder material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4432075A JPS51119651A (en) | 1975-04-14 | 1975-04-14 | Stannummmagnesiummzinc soft solder material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS51119651A true JPS51119651A (en) | 1976-10-20 |
| JPS532815B2 JPS532815B2 (Sortimente) | 1978-02-01 |
Family
ID=12688184
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4432075A Granted JPS51119651A (en) | 1975-04-14 | 1975-04-14 | Stannummmagnesiummzinc soft solder material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS51119651A (Sortimente) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2387347A (en) * | 2002-04-09 | 2003-10-15 | Ford Motor Co | Tin and Zinc-based solder fillers for aluminium body parts and methods of applying the same |
| US6824039B2 (en) * | 2002-03-26 | 2004-11-30 | Institute Of High Performance Computing | Lead free tin based solder composition |
| JP2006255784A (ja) * | 2004-11-24 | 2006-09-28 | Nittetsu Micro Metal:Kk | 無鉛ハンダ合金 |
| CN105562956A (zh) * | 2016-01-04 | 2016-05-11 | 东北大学 | 一种适用于镁铝异种合金钎焊的钎料及其制备方法 |
-
1975
- 1975-04-14 JP JP4432075A patent/JPS51119651A/ja active Granted
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6824039B2 (en) * | 2002-03-26 | 2004-11-30 | Institute Of High Performance Computing | Lead free tin based solder composition |
| GB2387347A (en) * | 2002-04-09 | 2003-10-15 | Ford Motor Co | Tin and Zinc-based solder fillers for aluminium body parts and methods of applying the same |
| US6840434B2 (en) | 2002-04-09 | 2005-01-11 | Ford Motor Company | Tin-and zinc-based solder fillers for aluminum body parts and methods of applying the same |
| GB2387347B (en) * | 2002-04-09 | 2005-09-14 | Ford Motor Co | Tin-based solder fillers for aluminium body parts and methods of applying the same |
| JP2006255784A (ja) * | 2004-11-24 | 2006-09-28 | Nittetsu Micro Metal:Kk | 無鉛ハンダ合金 |
| CN105562956A (zh) * | 2016-01-04 | 2016-05-11 | 东北大学 | 一种适用于镁铝异种合金钎焊的钎料及其制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS532815B2 (Sortimente) | 1978-02-01 |
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