JPS5111763U - - Google Patents
Info
- Publication number
- JPS5111763U JPS5111763U JP1974083564U JP8356474U JPS5111763U JP S5111763 U JPS5111763 U JP S5111763U JP 1974083564 U JP1974083564 U JP 1974083564U JP 8356474 U JP8356474 U JP 8356474U JP S5111763 U JPS5111763 U JP S5111763U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1974083564U JPS5111763U (enFirst) | 1974-07-15 | 1974-07-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1974083564U JPS5111763U (enFirst) | 1974-07-15 | 1974-07-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5111763U true JPS5111763U (enFirst) | 1976-01-28 |
Family
ID=28263908
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1974083564U Pending JPS5111763U (enFirst) | 1974-07-15 | 1974-07-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5111763U (enFirst) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020061805A (ja) * | 2018-10-05 | 2020-04-16 | 多摩川精機株式会社 | ワニスによる被固定部材の固定構造 |
| JP2020136495A (ja) * | 2019-02-20 | 2020-08-31 | 中央電子工業株式会社 | 中空パッケージ構造およびその製造方法、ならびに半導体装置およびその製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4979468A (enFirst) * | 1972-12-04 | 1974-07-31 |
-
1974
- 1974-07-15 JP JP1974083564U patent/JPS5111763U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4979468A (enFirst) * | 1972-12-04 | 1974-07-31 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020061805A (ja) * | 2018-10-05 | 2020-04-16 | 多摩川精機株式会社 | ワニスによる被固定部材の固定構造 |
| JP2020136495A (ja) * | 2019-02-20 | 2020-08-31 | 中央電子工業株式会社 | 中空パッケージ構造およびその製造方法、ならびに半導体装置およびその製造方法 |