JPS5111568A - Peretsutobondeinguho - Google Patents

Peretsutobondeinguho

Info

Publication number
JPS5111568A
JPS5111568A JP8218074A JP8218074A JPS5111568A JP S5111568 A JPS5111568 A JP S5111568A JP 8218074 A JP8218074 A JP 8218074A JP 8218074 A JP8218074 A JP 8218074A JP S5111568 A JPS5111568 A JP S5111568A
Authority
JP
Japan
Prior art keywords
bondeinguho
peretsuto
peretsuto bondeinguho
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8218074A
Other languages
English (en)
Inventor
Hiroshi Maejima
Masuzo Ikumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP8218074A priority Critical patent/JPS5111568A/ja
Publication of JPS5111568A publication Critical patent/JPS5111568A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10158—Shape being other than a cuboid at the passive surface
JP8218074A 1974-07-19 1974-07-19 Peretsutobondeinguho Pending JPS5111568A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8218074A JPS5111568A (ja) 1974-07-19 1974-07-19 Peretsutobondeinguho

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8218074A JPS5111568A (ja) 1974-07-19 1974-07-19 Peretsutobondeinguho

Publications (1)

Publication Number Publication Date
JPS5111568A true JPS5111568A (ja) 1976-01-29

Family

ID=13767225

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8218074A Pending JPS5111568A (ja) 1974-07-19 1974-07-19 Peretsutobondeinguho

Country Status (1)

Country Link
JP (1) JPS5111568A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0366468A (ja) * 1989-08-05 1991-03-22 Fuji Electric Co Ltd 加圧注湯式のるつぼ形無鉄心誘導炉
JPH0454559U (ja) * 1990-09-07 1992-05-11

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0366468A (ja) * 1989-08-05 1991-03-22 Fuji Electric Co Ltd 加圧注湯式のるつぼ形無鉄心誘導炉
JPH0454559U (ja) * 1990-09-07 1992-05-11

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