JPS51112270A - Time schedule checking method of bonding apparatus - Google Patents

Time schedule checking method of bonding apparatus

Info

Publication number
JPS51112270A
JPS51112270A JP50036793A JP3679375A JPS51112270A JP S51112270 A JPS51112270 A JP S51112270A JP 50036793 A JP50036793 A JP 50036793A JP 3679375 A JP3679375 A JP 3679375A JP S51112270 A JPS51112270 A JP S51112270A
Authority
JP
Japan
Prior art keywords
bonding apparatus
time schedule
checking method
schedule checking
pellet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50036793A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5436030B2 (enExample
Inventor
Eiji Misawa
Junichi Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50036793A priority Critical patent/JPS51112270A/ja
Publication of JPS51112270A publication Critical patent/JPS51112270A/ja
Publication of JPS5436030B2 publication Critical patent/JPS5436030B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Wire Bonding (AREA)
JP50036793A 1975-03-28 1975-03-28 Time schedule checking method of bonding apparatus Granted JPS51112270A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50036793A JPS51112270A (en) 1975-03-28 1975-03-28 Time schedule checking method of bonding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50036793A JPS51112270A (en) 1975-03-28 1975-03-28 Time schedule checking method of bonding apparatus

Publications (2)

Publication Number Publication Date
JPS51112270A true JPS51112270A (en) 1976-10-04
JPS5436030B2 JPS5436030B2 (enExample) 1979-11-07

Family

ID=12479656

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50036793A Granted JPS51112270A (en) 1975-03-28 1975-03-28 Time schedule checking method of bonding apparatus

Country Status (1)

Country Link
JP (1) JPS51112270A (enExample)

Also Published As

Publication number Publication date
JPS5436030B2 (enExample) 1979-11-07

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