JPS51105266A - Handotaisochino seizohoho - Google Patents

Handotaisochino seizohoho

Info

Publication number
JPS51105266A
JPS51105266A JP50030400A JP3040075A JPS51105266A JP S51105266 A JPS51105266 A JP S51105266A JP 50030400 A JP50030400 A JP 50030400A JP 3040075 A JP3040075 A JP 3040075A JP S51105266 A JPS51105266 A JP S51105266A
Authority
JP
Japan
Prior art keywords
handotaisochino seizohoho
handotaisochino
seizohoho
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50030400A
Other languages
Japanese (ja)
Other versions
JPS5734648B2 (en
Inventor
Masao Kachi
Hiroshi Asami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHINNIPPON DENKI KK
New Nippon Electric Co Ltd
Original Assignee
SHINNIPPON DENKI KK
New Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHINNIPPON DENKI KK, New Nippon Electric Co Ltd filed Critical SHINNIPPON DENKI KK
Priority to JP50030400A priority Critical patent/JPS51105266A/en
Publication of JPS51105266A publication Critical patent/JPS51105266A/en
Publication of JPS5734648B2 publication Critical patent/JPS5734648B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Electrodes Of Semiconductors (AREA)
JP50030400A 1975-03-13 1975-03-13 Handotaisochino seizohoho Granted JPS51105266A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50030400A JPS51105266A (en) 1975-03-13 1975-03-13 Handotaisochino seizohoho

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50030400A JPS51105266A (en) 1975-03-13 1975-03-13 Handotaisochino seizohoho

Publications (2)

Publication Number Publication Date
JPS51105266A true JPS51105266A (en) 1976-09-17
JPS5734648B2 JPS5734648B2 (en) 1982-07-24

Family

ID=12302869

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50030400A Granted JPS51105266A (en) 1975-03-13 1975-03-13 Handotaisochino seizohoho

Country Status (1)

Country Link
JP (1) JPS51105266A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5488076A (en) * 1977-12-24 1979-07-12 Fuji Electric Co Ltd Manufacture for semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5488076A (en) * 1977-12-24 1979-07-12 Fuji Electric Co Ltd Manufacture for semiconductor device

Also Published As

Publication number Publication date
JPS5734648B2 (en) 1982-07-24

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