JPS51102565A - - Google Patents

Info

Publication number
JPS51102565A
JPS51102565A JP50027149A JP2714975A JPS51102565A JP S51102565 A JPS51102565 A JP S51102565A JP 50027149 A JP50027149 A JP 50027149A JP 2714975 A JP2714975 A JP 2714975A JP S51102565 A JPS51102565 A JP S51102565A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50027149A
Other languages
Japanese (ja)
Inventor
Susumu Okikawa
Osamu Yugawa
Hiroshi Mikino
Yoshio Nonaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50027149A priority Critical patent/JPS51102565A/ja
Priority to US05/663,471 priority patent/US4123293A/en
Publication of JPS51102565A publication Critical patent/JPS51102565A/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3013—Au as the principal constituent
    • H10W40/255—
    • H10W70/02—
    • H10W72/073—
    • H10W72/07336—
    • H10W72/352—
    • H10W72/884—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP50027149A 1975-03-07 1975-03-07 Pending JPS51102565A (cg-RX-API-DMAC10.html)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP50027149A JPS51102565A (cg-RX-API-DMAC10.html) 1975-03-07 1975-03-07
US05/663,471 US4123293A (en) 1975-03-07 1976-03-03 Method of providing semiconductor pellet with heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50027149A JPS51102565A (cg-RX-API-DMAC10.html) 1975-03-07 1975-03-07

Publications (1)

Publication Number Publication Date
JPS51102565A true JPS51102565A (cg-RX-API-DMAC10.html) 1976-09-10

Family

ID=12212981

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50027149A Pending JPS51102565A (cg-RX-API-DMAC10.html) 1975-03-07 1975-03-07

Country Status (2)

Country Link
US (1) US4123293A (cg-RX-API-DMAC10.html)
JP (1) JPS51102565A (cg-RX-API-DMAC10.html)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5837713B2 (ja) * 1978-12-01 1983-08-18 富士通株式会社 半導体レ−ザ−装置の製造方法
FR2466860A1 (fr) * 1979-10-05 1981-04-10 Radiotechnique Compelec Procede de soudure d'un cristal semi-conducteur sur un support metallique et dispositif semi-conducteur comportant un cristal de silicium et un support nickele reunis par ce procede
DE3779968D1 (de) * 1986-08-08 1992-07-30 Siemens Ag Verfahren zur herstellung eines drucksensors.
US5008997A (en) * 1988-09-16 1991-04-23 National Semiconductor Gold/tin eutectic bonding for tape automated bonding process
EP0400177A1 (de) * 1989-05-31 1990-12-05 Siemens Aktiengesellschaft Verbindung eines Halbleiterbauelements mit einem Metallträger
US5652461A (en) * 1992-06-03 1997-07-29 Seiko Epson Corporation Semiconductor device with a convex heat sink
US5798566A (en) * 1996-01-11 1998-08-25 Ngk Spark Plug Co., Ltd. Ceramic IC package base and ceramic cover
KR100380107B1 (ko) * 2001-04-30 2003-04-11 삼성전자주식회사 발열체를 갖는 회로 기판과 기밀 밀봉부를 갖는 멀티 칩패키지
US7898076B2 (en) * 2007-04-30 2011-03-01 International Business Machines Corporation Structure and methods of processing for solder thermal interface materials for chip cooling
US7857194B2 (en) * 2007-05-01 2010-12-28 University Of Dayton Method of joining metals to ceramic matrix composites
US11387373B2 (en) * 2019-07-29 2022-07-12 Nxp Usa, Inc. Low drain-source on resistance semiconductor component and method of fabrication

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1969702A (en) * 1933-05-20 1934-08-07 Donald K Crampton High electro-conductive copper alloy and process for making the same
US2599002A (en) * 1948-09-20 1952-06-03 Ampco Metal Inc Method for working and heat-treating a copper base alloy
NL107577C (cg-RX-API-DMAC10.html) * 1954-07-01
US2897107A (en) * 1955-08-24 1959-07-28 Bolidens Gruv Ab Annealing properties of copper
US3047437A (en) * 1957-08-19 1962-07-31 Int Rectifier Corp Method of making a rectifier
US3097198A (en) * 1959-02-10 1963-07-09 Ici Ltd Azo dyestuffs
US3143442A (en) * 1962-01-23 1964-08-04 Mallory & Co Inc P R Copper-base alloys and method of heat treating them
NL128389C (cg-RX-API-DMAC10.html) * 1963-02-15
BE655630A (cg-RX-API-DMAC10.html) * 1963-11-14
CH465735A (de) * 1964-03-13 1968-11-30 Sandoz Ag Verfahren zur Herstellung von Monoazofarbstoffen
BE668126A (cg-RX-API-DMAC10.html) * 1964-08-10
BE668829A (cg-RX-API-DMAC10.html) * 1964-08-26
DE1282815B (de) * 1964-12-24 1968-11-14 Cassella Farbwerke Mainkur Ag Verfahren zur Herstellung wasserunloeslicher Monoazofarbstoffe
CH455085A (de) * 1965-01-14 1968-04-30 Sandoz Ag Verfahren zur Herstellung von Dispersionsfarbstoffen der Monoazoreihe
GB1114603A (en) * 1965-11-09 1968-05-22 Ici Ltd New monoazo dyestuffs containing ester groups
GB1176797A (en) * 1966-07-15 1970-01-07 Ici Ltd Water-insoluble Monoazo Dyestuffs
GB1226950A (cg-RX-API-DMAC10.html) * 1967-11-07 1971-03-31

Also Published As

Publication number Publication date
US4123293A (en) 1978-10-31

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