JPS51102463A - - Google Patents
Info
- Publication number
- JPS51102463A JPS51102463A JP50027525A JP2752575A JPS51102463A JP S51102463 A JPS51102463 A JP S51102463A JP 50027525 A JP50027525 A JP 50027525A JP 2752575 A JP2752575 A JP 2752575A JP S51102463 A JPS51102463 A JP S51102463A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50027525A JPS5826174B2 (ja) | 1975-03-05 | 1975-03-05 | ハンドウタイソウチ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50027525A JPS5826174B2 (ja) | 1975-03-05 | 1975-03-05 | ハンドウタイソウチ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS51102463A true JPS51102463A (ja) | 1976-09-09 |
| JPS5826174B2 JPS5826174B2 (ja) | 1983-06-01 |
Family
ID=12223524
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50027525A Expired JPS5826174B2 (ja) | 1975-03-05 | 1975-03-05 | ハンドウタイソウチ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5826174B2 (ja) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3436615A (en) * | 1967-08-09 | 1969-04-01 | Fairchild Camera Instr Co | Contact metal system of an allayer adjacent to semi-conductor and a layer of au-al intermetallics adjacent to the conductive metal |
| US3501681A (en) * | 1966-07-19 | 1970-03-17 | Union Carbide Corp | Face bonding of semiconductor devices |
| JPS4732600U (ja) * | 1971-04-30 | 1972-12-12 | ||
| US3760238A (en) * | 1972-02-28 | 1973-09-18 | Microsystems Int Ltd | Fabrication of beam leads |
| JPS5026077A (ja) * | 1973-07-09 | 1975-03-18 |
-
1975
- 1975-03-05 JP JP50027525A patent/JPS5826174B2/ja not_active Expired
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3501681A (en) * | 1966-07-19 | 1970-03-17 | Union Carbide Corp | Face bonding of semiconductor devices |
| US3436615A (en) * | 1967-08-09 | 1969-04-01 | Fairchild Camera Instr Co | Contact metal system of an allayer adjacent to semi-conductor and a layer of au-al intermetallics adjacent to the conductive metal |
| JPS4732600U (ja) * | 1971-04-30 | 1972-12-12 | ||
| US3760238A (en) * | 1972-02-28 | 1973-09-18 | Microsystems Int Ltd | Fabrication of beam leads |
| JPS5026077A (ja) * | 1973-07-09 | 1975-03-18 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5826174B2 (ja) | 1983-06-01 |