JPS51101469A - Shusekikairono chitsupugaihaisenhoho - Google Patents

Shusekikairono chitsupugaihaisenhoho

Info

Publication number
JPS51101469A
JPS51101469A JP50026711A JP2671175A JPS51101469A JP S51101469 A JPS51101469 A JP S51101469A JP 50026711 A JP50026711 A JP 50026711A JP 2671175 A JP2671175 A JP 2671175A JP S51101469 A JPS51101469 A JP S51101469A
Authority
JP
Japan
Prior art keywords
shusekikairono
chitsupugaihaisenhoho
shusekikairono chitsupugaihaisenhoho
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50026711A
Other languages
Japanese (ja)
Inventor
Hiroaki Nomura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suwa Seikosha KK
Original Assignee
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suwa Seikosha KK filed Critical Suwa Seikosha KK
Priority to JP50026711A priority Critical patent/JPS51101469A/en
Publication of JPS51101469A publication Critical patent/JPS51101469A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector

Landscapes

  • Wire Bonding (AREA)
JP50026711A 1975-03-04 1975-03-04 Shusekikairono chitsupugaihaisenhoho Pending JPS51101469A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50026711A JPS51101469A (en) 1975-03-04 1975-03-04 Shusekikairono chitsupugaihaisenhoho

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50026711A JPS51101469A (en) 1975-03-04 1975-03-04 Shusekikairono chitsupugaihaisenhoho

Publications (1)

Publication Number Publication Date
JPS51101469A true JPS51101469A (en) 1976-09-07

Family

ID=12200937

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50026711A Pending JPS51101469A (en) 1975-03-04 1975-03-04 Shusekikairono chitsupugaihaisenhoho

Country Status (1)

Country Link
JP (1) JPS51101469A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62244143A (en) * 1986-04-16 1987-10-24 Matsushita Electric Ind Co Ltd Electrical connection for semiconductor element
JPS6347942A (en) * 1986-08-18 1988-02-29 Fuji Xerox Co Ltd Semiconductor device
JPS63158846A (en) * 1986-12-22 1988-07-01 Semiconductor Energy Lab Co Ltd Method of mounting ic
US5001542A (en) * 1988-12-05 1991-03-19 Hitachi Chemical Company Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62244143A (en) * 1986-04-16 1987-10-24 Matsushita Electric Ind Co Ltd Electrical connection for semiconductor element
JPS6347942A (en) * 1986-08-18 1988-02-29 Fuji Xerox Co Ltd Semiconductor device
JPS63158846A (en) * 1986-12-22 1988-07-01 Semiconductor Energy Lab Co Ltd Method of mounting ic
JPH0325936B2 (en) * 1986-12-22 1991-04-09 Handotai Energy Kenkyusho
US5001542A (en) * 1988-12-05 1991-03-19 Hitachi Chemical Company Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips
US5120665A (en) * 1988-12-05 1992-06-09 Hitachi Chemical Company Method of using an anisotropically electroconductive adhesive having pressure-deformable electroconductive particles to electrically connect circuits

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