JPS5099466A - - Google Patents

Info

Publication number
JPS5099466A
JPS5099466A JP49145829A JP14582974A JPS5099466A JP S5099466 A JPS5099466 A JP S5099466A JP 49145829 A JP49145829 A JP 49145829A JP 14582974 A JP14582974 A JP 14582974A JP S5099466 A JPS5099466 A JP S5099466A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP49145829A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5099466A publication Critical patent/JPS5099466A/ja
Pending legal-status Critical Current

Links

Classifications

    • H10P50/00

Landscapes

  • Mechanical Treatment Of Semiconductor (AREA)
  • ing And Chemical Polishing (AREA)
  • Weting (AREA)
  • Engineering & Computer Science (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP49145829A 1973-12-28 1974-12-20 Pending JPS5099466A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US429420A US3869324A (en) 1973-12-28 1973-12-28 Method of polishing cadmium telluride

Publications (1)

Publication Number Publication Date
JPS5099466A true JPS5099466A (ja) 1975-08-07

Family

ID=23703170

Family Applications (1)

Application Number Title Priority Date Filing Date
JP49145829A Pending JPS5099466A (ja) 1973-12-28 1974-12-20

Country Status (5)

Country Link
US (1) US3869324A (ja)
JP (1) JPS5099466A (ja)
DE (1) DE2438877A1 (ja)
FR (1) FR2256001B1 (ja)
GB (1) GB1437934A (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6233784A (ja) * 1985-08-05 1987-02-13 Nec Corp 化合物結晶の加工方法
JPS62136362A (ja) * 1985-12-10 1987-06-19 Nec Corp 化合物結晶の加工方法
JPS62290135A (ja) * 1986-06-10 1987-12-17 Nippon Mining Co Ltd CdTeウェーハの鏡面研磨液ならびに鏡面研磨方法
JPH0514465U (ja) * 1991-08-07 1993-02-26 日本建鐵株式会社 締り金物の安全装置

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4376716A (en) * 1974-07-18 1983-03-15 The United States Of America As Represented By The Secretary Of The Air Force Preparation of stable sodium carbonate dispersions
US3979239A (en) * 1974-12-30 1976-09-07 Monsanto Company Process for chemical-mechanical polishing of III-V semiconductor materials
DE2600990A1 (de) * 1976-01-13 1977-07-21 Wacker Chemitronic Verfahren zum polieren von halbleiteroberflaechen, insbesondere galliumphosphidoberflaechen
US4380490A (en) * 1981-03-27 1983-04-19 Bell Telephone Laboratories, Incorporated Method of preparing semiconductor surfaces
US4343662A (en) * 1981-03-31 1982-08-10 Atlantic Richfield Company Manufacturing semiconductor wafer devices by simultaneous slicing and etching
US4435247A (en) 1983-03-10 1984-03-06 International Business Machines Corporation Method for polishing titanium carbide
JPH01253239A (ja) * 1988-04-01 1989-10-09 Mitsubishi Monsanto Chem Co AlGaAs表面研磨方法
US5258422A (en) * 1992-05-05 1993-11-02 Tredegar Industries, Inc. Compostable thermoplastic compositions
US5783497A (en) * 1994-08-02 1998-07-21 Sematech, Inc. Forced-flow wafer polisher
US5562530A (en) * 1994-08-02 1996-10-08 Sematech, Inc. Pulsed-force chemical mechanical polishing
US5527423A (en) * 1994-10-06 1996-06-18 Cabot Corporation Chemical mechanical polishing slurry for metal layers
US5968238A (en) * 1998-02-18 1999-10-19 Turtle Wax, Inc. Polishing composition including water soluble polishing agent

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2690383A (en) * 1952-04-29 1954-09-28 Gen Electric Co Ltd Etching of crystal contact devices
BE543254A (ja) * 1954-12-01
US3143447A (en) * 1960-12-22 1964-08-04 Marriner K Norr Chemical etches for lead telluride crystals
US3342652A (en) * 1964-04-02 1967-09-19 Ibm Chemical polishing of a semi-conductor substrate
US3429756A (en) * 1965-02-05 1969-02-25 Monsanto Co Method for the preparation of inorganic single crystal and polycrystalline electronic materials
US3629023A (en) * 1968-07-17 1971-12-21 Minnesota Mining & Mfg METHOD OF CHEMICALLY POLISHING CRYSTALS OF II(b){14 VI(a) SYSTEM
US3775201A (en) * 1971-10-26 1973-11-27 Ibm Method for polishing semiconductor gallium phosphide planar surfaces

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6233784A (ja) * 1985-08-05 1987-02-13 Nec Corp 化合物結晶の加工方法
JPS62136362A (ja) * 1985-12-10 1987-06-19 Nec Corp 化合物結晶の加工方法
JPS62290135A (ja) * 1986-06-10 1987-12-17 Nippon Mining Co Ltd CdTeウェーハの鏡面研磨液ならびに鏡面研磨方法
JPH0514465U (ja) * 1991-08-07 1993-02-26 日本建鐵株式会社 締り金物の安全装置

Also Published As

Publication number Publication date
US3869324A (en) 1975-03-04
DE2438877A1 (de) 1975-07-03
FR2256001B1 (ja) 1976-10-22
FR2256001A1 (ja) 1975-07-25
GB1437934A (en) 1976-06-03

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