JPS5092257A - - Google Patents
Info
- Publication number
- JPS5092257A JPS5092257A JP48141452A JP14145273A JPS5092257A JP S5092257 A JPS5092257 A JP S5092257A JP 48141452 A JP48141452 A JP 48141452A JP 14145273 A JP14145273 A JP 14145273A JP S5092257 A JPS5092257 A JP S5092257A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Control Of Metal Rolling (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP48141452A JPS5092257A (en) | 1973-12-18 | 1973-12-18 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP48141452A JPS5092257A (en) | 1973-12-18 | 1973-12-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5092257A true JPS5092257A (en) | 1975-07-23 |
Family
ID=15292230
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP48141452A Pending JPS5092257A (en) | 1973-12-18 | 1973-12-18 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5092257A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005096367A1 (en) | 2004-03-30 | 2005-10-13 | Tamura Corporation | Heater, reflow apparatus, and solder bump forming method and apparatus |
-
1973
- 1973-12-18 JP JP48141452A patent/JPS5092257A/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005096367A1 (en) | 2004-03-30 | 2005-10-13 | Tamura Corporation | Heater, reflow apparatus, and solder bump forming method and apparatus |