JPS5084988A - - Google Patents
Info
- Publication number
- JPS5084988A JPS5084988A JP11685674A JP11685674A JPS5084988A JP S5084988 A JPS5084988 A JP S5084988A JP 11685674 A JP11685674 A JP 11685674A JP 11685674 A JP11685674 A JP 11685674A JP S5084988 A JPS5084988 A JP S5084988A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US41922073A | 1973-11-26 | 1973-11-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5084988A true JPS5084988A (en, 2012) | 1975-07-09 |
Family
ID=23661310
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11685674A Pending JPS5084988A (en, 2012) | 1973-11-26 | 1974-10-12 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPS5084988A (en, 2012) |
DE (1) | DE2454802A1 (en, 2012) |
FR (1) | FR2252390A1 (en, 2012) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5969932A (ja) * | 1982-10-07 | 1984-04-20 | ワツカ−・ヘミトロニク・ゲゼルシヤフト・フユア・エレクトロニク・グルントシユトツフエ・ミツト・ベシユレンクテル・ハフツング | 第3〜5族半導体表面の研摩方法 |
JPS61192783A (ja) * | 1985-02-22 | 1986-08-27 | Lion Corp | 清掃研摩基材 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4057939A (en) * | 1975-12-05 | 1977-11-15 | International Business Machines Corporation | Silicon wafer polishing |
-
1974
- 1974-10-12 JP JP11685674A patent/JPS5084988A/ja active Pending
- 1974-11-19 DE DE19742454802 patent/DE2454802A1/de active Pending
- 1974-11-25 FR FR7438639A patent/FR2252390A1/fr not_active Withdrawn
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5969932A (ja) * | 1982-10-07 | 1984-04-20 | ワツカ−・ヘミトロニク・ゲゼルシヤフト・フユア・エレクトロニク・グルントシユトツフエ・ミツト・ベシユレンクテル・ハフツング | 第3〜5族半導体表面の研摩方法 |
JPS61192783A (ja) * | 1985-02-22 | 1986-08-27 | Lion Corp | 清掃研摩基材 |
Also Published As
Publication number | Publication date |
---|---|
FR2252390A1 (en) | 1975-06-20 |
DE2454802A1 (de) | 1975-05-28 |