JPS5081272A - - Google Patents

Info

Publication number
JPS5081272A
JPS5081272A JP12960973A JP12960973A JPS5081272A JP S5081272 A JPS5081272 A JP S5081272A JP 12960973 A JP12960973 A JP 12960973A JP 12960973 A JP12960973 A JP 12960973A JP S5081272 A JPS5081272 A JP S5081272A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12960973A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12960973A priority Critical patent/JPS5081272A/ja
Publication of JPS5081272A publication Critical patent/JPS5081272A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Wire Bonding (AREA)
JP12960973A 1973-11-16 1973-11-16 Pending JPS5081272A (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12960973A JPS5081272A (enrdf_load_stackoverflow) 1973-11-16 1973-11-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12960973A JPS5081272A (enrdf_load_stackoverflow) 1973-11-16 1973-11-16

Publications (1)

Publication Number Publication Date
JPS5081272A true JPS5081272A (enrdf_load_stackoverflow) 1975-07-01

Family

ID=15013680

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12960973A Pending JPS5081272A (enrdf_load_stackoverflow) 1973-11-16 1973-11-16

Country Status (1)

Country Link
JP (1) JPS5081272A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57207357A (en) * 1981-06-17 1982-12-20 Asahi Glass Co Ltd Component part holder
JPS5994432A (ja) * 1982-10-21 1984-05-31 アボツト・ラボラトリ−ズ 半導体検知装置
JPS6142928A (ja) * 1984-07-31 1986-03-01 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 半導体パワ−・デバイス・パツケ−ジ

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57207357A (en) * 1981-06-17 1982-12-20 Asahi Glass Co Ltd Component part holder
JPS5994432A (ja) * 1982-10-21 1984-05-31 アボツト・ラボラトリ−ズ 半導体検知装置
JPS6142928A (ja) * 1984-07-31 1986-03-01 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 半導体パワ−・デバイス・パツケ−ジ

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